Bond strength of Biodentine to a resin-based composite at various acid etching times and with different adhesive strategies.

Dent Med Probl

Department of Conservative Dentistry, Chair of Conservative Dentistry and Endodontics, Faculty of Medicine with the Division of Dentistry, Medical University of Lodz, Poland.

Published: November 2019

Background: Biodentine® is a bioactive calcium silicate-based material, with better strength parameters, an easier application method and a shorter setting time than mineral trioxide aggregate (MTA). The bond strength between Biodentine and the composite material is essential for the durability of the layered restoration.

Objectives: The objective of this study was to evaluate the bond strength of Biodentine to a resin-based composite at various acid etching times and with different adhesive strategies.

Material And Methods: In the 1st part of the experiment, the specimens were divided into 2 groups: the adhesive was applied in the total-etch (TE) and self-etch (SE) techniques. In the TE group, 37% orthophosphoric acid was applied after 30 s (TE 30) and 240 s (TE 240). In the SE group, the SE system was applied for 30 s (SE 30) and 240 s (SE 240). In the 2nd part, the SE systems Clearfil® SE Bond and Clearfil S3 Bond Plus were evaluated (the CSE and CS3 groups, respectively). In each group, the adhesive system was applied in 1 (the CSE 1 and CS3 1 subgroups) or 2 layers (the CSE 2 and CS3 2 subgroups). The specimens were subjected to a shear bond strength (SBS) test in a universal testing machine.

Results: Shear bond strength was higher after a prolonged etching procedure in the TE (TE 30: 2.51 MPa, TE 240: 9.39 MPa) and SE techniques (SE 30: 5.92 MPa, SE 240: 7.89 MPa). A statistically significant influence was detected in relation to 30 s of surface preparation time for Clearfil S3 Bond Plus (p < 0.001). Greater bond strength was revealed after the application of 1 layer of the Clearfil S3 Bond Plus single-bottle system (CS3 1: 6.42 MPa).

Conclusions: The SBS of Biodentine to the composite depends on both the etching time and the mode of application of the adhesive systems. Higher bond strength was obtained for the SE adhesive in a shorter application time.

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Source
http://dx.doi.org/10.17219/dmp/103589DOI Listing

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