Low-Loss and Light Substrate Integrated Waveguide Using 3D Printed Honeycomb Structure.

Materials (Basel)

School of Electrical and Electronics Engineering, College of Engineering, Chung-Ang University, Seoul 06974, Korea.

Published: January 2019

This article proposes a low-loss and light 3D-printed substrate-integrated waveguide (SIW). Despite the use of lossy polylactic acid (PLA) material, insertion loss is reduced, and bandwidth is increased due to a honeycomb substrate similar to air. To demonstrate the proposed concept, we fabricated microstrip-fed SIWs with solid PLA and honeycomb substrates, and compared their performance numerically and experimentally. Average measured insertion loss from 3.4 to 5.5 GHz for the honeycomb SIW is 1.38 dB, whereas SIW with solid PLA is 3.15 dB. Light weight is an additional advantage of the proposed structure.

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Source
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC6384586PMC
http://dx.doi.org/10.3390/ma12030402DOI Listing

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