We report the preparation of 3D binder-free Si@Ti@TiN thin film array electrodes for supercapacitors using deep silicon etching and magnetron sputtering for the first time. This work not only offers the 3D array structure of Si@Ti@TiN thin films, but also paves a promising way for the construction of high-energy storage systems.
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| http://dx.doi.org/10.1039/c8cc08219g | DOI Listing |
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