Fabrication of an Aluminum-Based Thermoelectric Module Substrate via Anodization and Nickel Plating.

In this study, a thermoelectric module substrate was fabricated by subjecting an aluminum plate to a surface treatment process. To achieve this, the aluminum-based substrate was carried out to electrolytic etching, anodization, and Ni plating. The anodization of aluminum created an oxide film, which served as an insulation layer, while the Ni plating formed a conductive circuit layer. The substrate fabricated in this study exhibited excellent insulation performance, demonstrating its potential for future use in thermoelectric module substrates. Its adhesion properties were verified using a cross-cut adhesion test; microstructures of the surface and cross-section revealed the successful formation of the oxide film and Ni circuit layers on the aluminum base. From the results of these, it is clearly confirmed that the anodized aluminum substrate developed in this study provides suitable insulating performances and bonding nature with Ni electrode.