The field of semiconductor nanowires (NWs) has become one of the most active and mature research areas. However, progress in this field has been limited, due to the difficulty in controlling the density, orientation, and placement of the individual NWs, parameters important for mass producing nanodevices. The work presented herein describes a novel nanosynthesis strategy for ultrathin self-aligned silicon carbide (SiC) NW arrays (≤ 20 nm width, 130 nm height and 200⁻600 nm variable periodicity), with high quality (~2 Å surface roughness, ~2.4 eV optical bandgap) and reproducibility at predetermined locations, using fabrication protocols compatible with silicon microelectronics. Fourier transform infrared spectroscopy, X-ray photoelectron spectroscopy, ultraviolet-visible spectroscopic ellipsometry, atomic force microscopy, X-ray diffractometry, and transmission electron microscopy studies show nanosynthesis of high-quality polycrystalline cubic 3C-SiC materials (average 5 nm grain size) with tailored properties. An extension of the nanofabrication process is presented for integrating technologically important erbium ions as emission centers at telecom C-band wavelengths. This integration allows for deterministic positioning of the ions and engineering of the ions' spontaneous emission properties through the resulting NW-based photonic structures, both of which are critical to practical device fabrication for quantum information applications. This holistic approach can enable the development of new scalable SiC nanostructured materials for use in a plethora of emerging applications, such as NW-based sensing, single-photon sources, quantum LEDs, and quantum photonics.
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http://dx.doi.org/10.3390/nano8110906 | DOI Listing |
Microsyst Nanoeng
December 2024
Micro- and Nano-technology Research Center, State Key Laboratory for Manufacturing Systems Engineering, Xi'an Jiaotong University, Xi'an, Shaanxi, 710049, China.
Conformal electronic devices on freeform surface play a critical role in the emerging smart robotics, smart skins, and integrated sensing systems. However, their functional structures such as circuits tend to tear-off, break, or crack under mechanical or thermal influence when in service, thus limiting the application reliability of conformal electronics. Herein, inspired by the tree root system, template-confined additive (TCA) printing technology was presented for reliable fabrication of robust circuits.
View Article and Find Full Text PDFNanomaterials (Basel)
April 2024
Institute of Microelectronics Technology and High-Purity Materials, Russian Academy of Science (IMT RAS), 6 Academician Ossipyan Str., Moscow District, Chernogolovka 142432, Russia.
Resistive random-access memory (RRAM) is a crucial element for next-generation large-scale memory arrays, analogue neuromorphic computing and energy-efficient System-on-Chip applications. For these applications, RRAM elements are arranged into Crossbar arrays, where rectifying selector devices are required for correct read operation of the memory cells. One of the key advantages of RRAM is its high scalability due to the filamentary mechanism of resistive switching, as the cell conductivity is not dependent on the cell area.
View Article and Find Full Text PDFNanoscale
May 2024
National Key Laboratory of Advanced Micro and Nano Manufacture Technology, School of Integrated Circuits, Peking University, Beijing 100871, P. R. China.
This paper reports a new terahertz metasurface microfluidic sensor, which is actually a kind of reflective terahertz metasurface absorber with a microfluidic-channel structure located in the strong field energy region of the absorber. The metasurface structure is made on an ultra-thin quartz substrate as the cap layer, while a two-step structure is made on a silicon substrate as the pedestal layer. In order to precisely control the thickness of the microfluidic channel, the cap layer is self-aligned assembled with the pedestal layer to form the terahertz metasurface microfluidic sensor.
View Article and Find Full Text PDFACS Appl Mater Interfaces
February 2023
School of Electronic and Computer Engineering, Peking University, Shenzhen 518055, China.
An ultrathin atomic-layer-deposited (ALD) AlO gate insulator (GI) was implemented for self-aligned top-gate (SATG) amorphous InGaZnO (a-IGZO) thin-film transistors (TFTs). Although the 4.0-nm thick AlO exhibited ideal insulating properties, the interaction between ALD AlO and predeposited a-IGZO caused a relatively defective interface, thus giving rise to hysteresis and bias stress instabilities.
View Article and Find Full Text PDFAdv Mater
September 2022
Department of Electrical and Electronic Engineering, Southern University of Science and Technology, Shenzhen, 518055, China.
Chiral metasurfaces can exhibit a strong circular dichroism, but it is limited by the complicated fabrication procedure and alignment errors. Here, a new type of self-aligned suspended chiral bilayer metasurface with only one-step electron beam lithography exposure is demonstrated. A significant optical chirality of 221° µm can be realized using suspended metasurfaces with a thickness of 100 nm.
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