Severity: Warning
Message: file_get_contents(https://...@gmail.com&api_key=61f08fa0b96a73de8c900d749fcb997acc09&a=1): Failed to open stream: HTTP request failed! HTTP/1.1 429 Too Many Requests
Filename: helpers/my_audit_helper.php
Line Number: 176
Backtrace:
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 176
Function: file_get_contents
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 250
Function: simplexml_load_file_from_url
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 1034
Function: getPubMedXML
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 3152
Function: GetPubMedArticleOutput_2016
File: /var/www/html/application/controllers/Detail.php
Line: 575
Function: pubMedSearch_Global
File: /var/www/html/application/controllers/Detail.php
Line: 489
Function: pubMedGetRelatedKeyword
File: /var/www/html/index.php
Line: 316
Function: require_once
Alumina dispersion-strengthened copper, Glidcop, is used widely in high-heat-load ultra-high-vacuum components for synchrotron light sources (absorbers), accelerator components (beam intercepting devices), and in nuclear power plants. Glidcop has similar thermal and electrical properties to oxygen free electrical (OFE) copper, but has superior mechanical properties, thus making it a feasible structural material; its yield and ultimate tensile strength are equivalent to those of mild-carbon steel. The purpose of this work has been to develop a brazing technique to join Glidcop to Mo, using a commercial Cu-based alloy. The effects of the excessive diffusion of the braze along the grain boundaries on the interfacial chemistry and joint microstructure, as well as on the mechanical performance of the brazed joints, has been investigated. In order to prevent the diffusion of the braze into the Glidcop alloy, a copper barrier layer has been deposited on Glidcop by means of RF-sputtering.
Download full-text PDF |
Source |
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http://www.ncbi.nlm.nih.gov/pmc/articles/PMC6164998 | PMC |
http://dx.doi.org/10.3390/ma11091658 | DOI Listing |
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