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http://dx.doi.org/10.1053/j.gastro.2018.08.051 | DOI Listing |
Clin Exp Dermatol
October 2024
Department of Dermatology, Portsmouth Hospitals University NHS Trust, Portsmouth, UK.
Skin problems are common in returning travellers, despite the fact that vaccination, insect repellent techniques, adequate clothing and footwear are all ways to prevent skin disease. When travelling to unusual areas, the traveller can still expect to pick up diseases that are common across the world, such as lice, scabies, and staphylococcal or streptococcal infections. What can differ are the different arthropods and the diseases they can spread.
View Article and Find Full Text PDFProc Natl Acad Sci U S A
January 2024
Department of Engineering Mechanics, Soft Matter Research Center, and Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, Zhejiang University, Hangzhou 310027, China.
Transfer printing that enables heterogeneous integration of materials into spatially organized, functional arrangements is essential for developing unconventional electronic systems. Here, we report a laser-driven noncontact bubble transfer printing via a hydrogel composite stamp, which features a circular reservoir filled with hydrogel inside a stamp body and encapsulated by a laser absorption layer and an adhesion layer. This composite structure of stamp provides a reversible thermal controlled adhesion in a rapid manner through the liquid-gas phase transition of water in the hydrogel.
View Article and Find Full Text PDFNat Commun
November 2023
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea.
Transfer printing of inorganic thin-film semiconductors has attracted considerable attention to realize high-performance soft electronics on unusual substrates. However, conventional transfer technologies including elastomeric transfer printing, laser-assisted transfer, and electrostatic transfer still have challenging issues such as stamp reusability, additional adhesives, and device damage. Here, a micro-vacuum assisted selective transfer is reported to assemble micro-sized inorganic semiconductors onto unconventional substrates.
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