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Apparatus for combined nanoscale gravimetric, stress, and thermal measurements. | LitMetric

Apparatus for combined nanoscale gravimetric, stress, and thermal measurements.

Rev Sci Instrum

Institute for Research in Electronics and Applied Physics, University of Maryland, College Park, Maryland 20742, USA.

Published: August 2018

AI Article Synopsis

  • The presented apparatus enables simultaneous measurement of mass change, heat evolution, and stress in thin film samples on quartz crystal microbalances (QCMs) under specific conditions.
  • It demonstrates precise quantification of curvature changes and mass variations in materials subject to significant stress fluctuations using a palladium film.
  • The device's advanced calibration allows for accurate thermal measurements, enhancing the understanding of nanoscale reactions like hydrogenation in metal films and nanostructures.

Article Abstract

We present an apparatus that allows for the simultaneous measurement of mass change, heat evolution, and stress of thin film samples deposited on quartz crystal microbalances (QCMs). We show device operation at 24.85 ± 0.05 °C under 9.31 ± 0.02 bars of H as a reactive gas. Using a 335 nm palladium film, we demonstrate that our apparatus quantifies curvature changes of 0.001 m. Using the QCM curvature to account for stress induced frequency changes, we demonstrate the measurement of mass changes of 13 ng/cm in material systems exhibiting large stress fluctuations. We use a one-state nonlinear lumped element model to describe our system with thermal potentials measured at discrete positions by three resistance temperature devices lithographically printed on the QCM. By inputting known heat amounts through lithographically defined Cr/Al wires, we demonstrate a 150 W calorimetric accuracy and 20 W minimum detectable power. The capabilities of this instrument will allow for a more complete characterization of reactions occurring in nanoscale systems, such as the effects of hydrogenation in various metal films and nanostructures, as well as allow for direct stress compensation in QCM measurements.

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Source
http://dx.doi.org/10.1063/1.5040503DOI Listing

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