Evaluation of Laser Tissue Welding and Laser-Tissue Soldering for Mucosal and Vascular Repair.

Ann Maxillofac Surg

Department of Oral and Maxillofacial Surgery, MGM Dental College and Hospital, Mumbai, Maharashtra, India.

Published: January 2018

Context: Laser tissue bonding (LTB) is believed to have certain advantages over conventional sutures such as fluid-tight closure and minimal scarring and fibrosis.

Aim: The aim of the present study was to evaluate the bond strength of laser tissue welding and laser tissue soldering in mucosal and vascular repair.

Materials And Methods: A total of 85 samples of bovine oral mucosa and 85 bovine aortas were bonded using a CO laser and different laser powers. Human serum albumin was used as solder. The breaking load for mucosal samples and the bursting pressure for aorta samples were evaluated. Few specimens were evaluated histologically for thermal damage and other microscopic changes.

Statistical Methods: Two-way ANOVA was performed as the data were normally distributed and analyzed for significant differences between the groups. This was followed by Simple Main effects (Tuckey's test) to determine the individual variation between groups and also the significant differences within the groups.

Results: Significantly higher values of breaking load (44.2 ± 3.03 g) and bursting pressure (70.8 ± 12.33 mmHg) were noted when 50% albumin was used. When reinforcing sutures were given the bond strength was further increased (68.0 ± 4.0 g for breaking load) (108.0 ± 12.56 mmHg for bursting pressure). Microscopically, a bridge of solder coagulum formed across the wound. Thermal damage was restricted to the top layers only although it did extend much more laterally adjacent to the wound edges. Few areas of vacuolization and carbonization were seen.

Conclusion: LTB seems to be a promising new method of wound closure and warrants further evaluation in the form of and clinical studies.

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Source
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC6018299PMC
http://dx.doi.org/10.4103/ams.ams_147_17DOI Listing

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