Snap evaporation of droplets on smooth topographies.

Nat Commun

Smart Materials & Surfaces Laboratory, Faculty of Engineering and Environment, Northumbria University, Ellison Place, Newcastle upon, Tyne, NE1 8ST, UK.

Published: April 2018

AI Article Synopsis

  • Droplet evaporation on solid surfaces is crucial for applications like printing and cooling, but its behavior is often unpredictable due to surface roughness that causes "stick-slip" movement.
  • During evaporation, smooth, non-planar surfaces can facilitate a process called snap evaporation, where droplets change shape in a controlled manner, leading to efficient evaporation.
  • This study suggests that using engineered smooth surfaces could lead to innovative designs for managing liquids in various applications, enhancing heat and mass transfer efficiency.

Article Abstract

Droplet evaporation on solid surfaces is important in many applications including printing, micro-patterning and cooling. While seemingly simple, the configuration of evaporating droplets on solids is difficult to predict and control. This is because evaporation typically proceeds as a "stick-slip" sequence-a combination of pinning and de-pinning events dominated by static friction or "pinning", caused by microscopic surface roughness. Here we show how smooth, pinning-free, solid surfaces of non-planar topography promote a different process called snap evaporation. During snap evaporation a droplet follows a reproducible sequence of configurations, consisting of a quasi-static phase-change controlled by mass diffusion interrupted by out-of-equilibrium snaps. Snaps are triggered by bifurcations of the equilibrium droplet shape mediated by the underlying non-planar solid. Because the evolution of droplets during snap evaporation is controlled by a smooth topography, and not by surface roughness, our ideas can inspire programmable surfaces that manage liquids in heat- and mass-transfer applications.

Download full-text PDF

Source
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC5895805PMC
http://dx.doi.org/10.1038/s41467-018-03840-6DOI Listing

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