This work presents a simple, low-cost method to fabricate semi-circular channels using solder paste, which can amalgamate the cooper surface to form a half-cylinder mold using the surface tension of Sn-Pd alloy (the main component in solder paste). This technique enables semi-circular channels to be manufactured with different dimensions. These semi-circular channels will then be integrated with a polymethylmethacrylate frame and machine screws to create miniaturized, portable microfluidic valves for sequential liquid delivery and particle synthesis. This approach avoids complicated fabrication processes and expensive facilities and thus has the potential to be a useful tool for lab-on-a-chip applications.
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http://dx.doi.org/10.1002/elps.201800064 | DOI Listing |
Mater Horiz
January 2025
State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an, 710049, P. R. China.
Sci Rep
December 2024
Department of Materials Science and Chemical Engineering, Harbin University of Science and Technology, Harbin, 150040, People's Republic of China.
The effect of carbon fibers (Cf) and Ni nanoparticles addition on the melting point, microstructure, shear strength, indentation hardness and indentation creep of SnBi/Cu solder joints were explored. Composite solder with various Cf percentages (0, 0.02, 0.
View Article and Find Full Text PDFMaterials (Basel)
November 2024
Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China.
With the advancement of high-integration and high-density interconnection in chip manufacturing and packaging, Cu bumping technology in wafer- and panel- level packaging is developed to micrometer-sized structures and pitches to accommodate increased I/O numbers on high-end integrated circuits. Driven by this industrial demand, significant efforts have been dedicated to Cu electroplating techniques for improved pillar shape control and solder joint reliability, which substantially depend on additive formulations and electroplating parameters that regulate the growth morphology, crystal structure, and impurity incorporation in the process of electrodeposition. It is necessary to investigate the effect of an additive on Cu pillar electrodeposition, and to explore the Kirkendall voids formed during the reflowing process, which may result from the additive-induced impurity in the electrodeposited Cu pillars.
View Article and Find Full Text PDFMaterials (Basel)
September 2024
State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou 510006, China.
The sintering process of Cu nanoparticle (Cu NP)/graphene nanoplatelet (GNP) composite solder paste was thoroughly investigated in this work through molecular dynamics simulations. The tensile properties of the sintered Cu NP/GNP composite solder paste were considered by using the uniaxial quasi-static tensile simulation method. The impact of sintering temperature, strain rate, and GNP addition on the tensile properties of Cu NP/GNP sintered structures was thoroughly investigated.
View Article and Find Full Text PDFPolymers (Basel)
September 2024
Joining and Welding Research Institute, Osaka University, Ibaraki 5670047, Japan.
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