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Grain-by-Grain Compositional Variations and Interstitial Metals-A New Route toward Achieving High Performance in Half-Heusler Thermoelectrics. | LitMetric

AI Article Synopsis

  • - Half-Heusler alloys made from TiNiSn show great potential as thermoelectric materials due to their high power factors and stability, but they struggle with high thermal conductivity.
  • - Researchers introduced a new method using excess copper to create compositional variations and interstitials that decrease thermal conductivity via point-defect scattering.
  • - The resulting TiNiCuSn alloys achieve a ZT value of 0.3-0.4 and power outputs of 6-7 W cm, making them viable for mass production since they use non-toxic and less expensive materials.

Article Abstract

Half-Heusler alloys based on TiNiSn are promising thermoelectric materials characterized by large power factors and good mechanical and thermal stabilities, but they are limited by large thermal conductivities. A variety of strategies have been used to disrupt their thermal transport, including alloying with heavy, generally expensive, elements and nanostructuring, enabling figures of merit, ZT ≥ 1 at elevated temperatures (>773 K). Here, we demonstrate an alternative strategy that is based around the partial segregation of excess Cu leading to grain-by-grain compositional variations, the formation of extruded Cu "wetting layers" between grains, and-most importantly-the presence of statistically distributed interstitials that reduce the thermal conductivity effectively through point-defect scattering. Our best TiNiCuSn (y ≤ 0.1) compositions have a temperature-averaged ZT = 0.3-0.4 and estimated leg power outputs of 6-7 W cm in the 323-773 K temperature range. This is a significant development as these materials were prepared using a straightforward processing method, do not contain any toxic, expensive, or scarce elements, and are therefore promising candidates for large-scale production.

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Source
http://dx.doi.org/10.1021/acsami.7b14525DOI Listing

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