Flexible gallium nitride (GaN) thin films can enable future strainable and conformal devices for transmission of radio-frequency (RF) signals over large distances for more efficient wireless communication. For the first time, strainable high-frequency RF GaN devices are demonstrated, whose exceptional performance is enabled by epitaxial growth on 2D boron nitride for chemical-free transfer to a soft, flexible substrate. The AlGaN/GaN heterostructures transferred to flexible substrates are uniaxially strained up to 0.85% and reveal near state-of-the-art values for electrical performance, with electron mobility exceeding 2000 cm V s and sheet carrier density above 1.07 × 10 cm . The influence of strain on the RF performance of flexible GaN high-electron-mobility transistor (HEMT) devices is evaluated, demonstrating cutoff frequencies and maximum oscillation frequencies greater than 42 and 74 GHz, respectively, at up to 0.43% strain, representing a significant advancement toward conformal, highly integrated electronic materials for RF applications.
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http://dx.doi.org/10.1002/adma.201701838 | DOI Listing |
Gels
November 2024
Electro-Medical Equipment Research Division, Korea Electrotechnology Research Institute (KERI), Ansan 15588, Republic of Korea.
Shape-memory materials are widely utilized in biomedical devices and tissue engineering, particularly for their ability to undergo predefined shape changes in response to external stimuli. In this study, a shape-transformable organohydrogel was developed by incorporating a gallium mesh into a polyacrylamide/alginate/glycerol matrix. The gallium mesh, which transitions between solid and liquid states at moderate temperatures (~29.
View Article and Find Full Text PDFSmall
December 2024
School of Materials Science &Engineering, Tongji University, Shanghai, 201804, P. R. China.
Hydrogel-based flexible electronic components have become the optimal solution to address the rigidity problem of traditional electronics in health management. In this study, a multipurpose hydrogel is introduced, which is formed by combining a dual-network consisting of physical (chitosan, polyvinyl alcohol (PVA)) and chemical (poly(isopropyl acrylamide (NIPAM)-co-acrylamide (AM))) cross-linking, along with signal conversion fillers (eutectic gallium indium (EGaIn), TiC MXene, polyaniline (PANI)) for responding to external stimuli. Multiple sensing of dynamic and static signals is permissible for it.
View Article and Find Full Text PDFAdv Sci (Weinh)
December 2024
Department of Electrical Engineering, Eindhoven University of Technology, Eindhoven, 5612AP, The Netherlands.
Brain-computer interfaces (BCIs) are evolving toward higher electrode count and fully implantable solutions, which require extremely low power densities (<15mW cm). To achieve this target, and allow for a large and scalable number of channels, flexible electronics can be used as a multiplexing interface. This work introduces an active analog front-end fabricated with amorphous Indium-Gallium-Zinx-Oxide (a-IGZO) Thin-Film Transistors (TFTs) on foil capable of active matrix multiplexing.
View Article and Find Full Text PDFACS Appl Mater Interfaces
December 2024
Advanced Functional Polymers Center, KRICT, Daejeon 34114, Republic of Korea.
Thin-film transistors offer excellent and uniform electrical properties over large areas, making them a promising option for various future electronic devices. Polyimide dielectrics are already widely used in various electronic devices because of their exceptional dielectric properties, thermal stability, and desirable mechanical flexibility, which make them suitable for harsh environments. However, the current research on polyimide dielectric materials has certain limitations, such as the use of toxic solvents, high-temperature processes, and deficient coating properties.
View Article and Find Full Text PDFHeliyon
November 2024
Department of Mechanical and Industrial Engineering, College of Engineering, Qatar University, 2713, Doha, Qatar.
Developing thermoelectric films without substrates-free-standing films-eliminates substrate-induced effects on performance and meets the flexibility requirements of emerging wearable thermoelectric applications. This study investigates Gallium-doped Zinc Oxide (GZO), composed of abundant and non-toxic elements, to fabricate a substrate-free GZO film via 3D printing and compares its structural, chemical, and thermoelectric properties with those of a substrate-constrained GZO film produced through chemical deposition. Both films exhibited uniform crystal structures and phase purity; however, the substrate-constrained film displayed additional diffraction peaks, suggesting potential substrate interactions.
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