In this review, we present an extensive summary of research on superhydrophobic electrodeposits reported in the literature over the past decade. As a synthesis technique, electrodeposition is a simple and scalable process to produce non-wetting metal surfaces. There are three main categories of superhydrophobic surfaces made by electrodeposition: (i) electrodeposits that are inherently non-wetting due to hierarchical roughness generated from the process; (ii) electrodeposits with plated surface roughness that are further modified with low surface energy material; (iii) composite electrodeposits with co-deposited inert and hydrophobic particles. A recently developed strategy to improve the durability during the application of superhydrophobic electrodeposits by controlling the microstructure of the metal matrix and the co-deposition of hydrophobic ceramic particles will also be addressed.
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http://dx.doi.org/10.3390/ma9030151 | DOI Listing |
Heliyon
September 2024
Faculty of Materials and Metallurgical Engineering, Semnan University, Semnan, Iran.
Copper and its alloys due to favorable properties such as ductility, high electrical and thermal conductivity are very important in various industries. The coating of rare earth elements and intermediate elements is a suitable method to form a super-hydrophobic coating on copper substrate. The aim of this research is to fabricate a controlled super-hydrophobic coating of cerium-zirconium myristate on the copper base using the electrochemical deposition process and to prevent the corrosive solution penetration and reaching to the copper substrate due to removing the corrosive solution from the surface of the coating.
View Article and Find Full Text PDFLangmuir
August 2024
School of Materials Science and Engineering, Northeastern University, Shenyang 110819, China.
Superhydrophobic surfaces have received widespread attention for their unique hydrophobicity in metal corrosion protection. However, the shortcomings of mechanical stability and long-term corrosion resistance limit their practical application. In this work, we designed and fabricated an anticorrosive and friction reducing Ni-P/CeO superhydrophobic composite (SC) coating on a copper surface.
View Article and Find Full Text PDFLangmuir
July 2024
Ministry of Education, Key Laboratory for the Green Preparation and Application of Functional Materials, Hubei University, Wuhan 430062, People's Republic of China.
Regular array structures prepared by laser processing and three-dimensional printing have promising applications in building stable superhydrophobic structures. However, the size of the materials processed by these two methods is affected by the size of the processing equipment, which prevents the processing of large-size materials. In this paper, a columnar unit consisting of a spherical structure with similar mechanical stability to the array structure is designed and prepared for metal surface protection.
View Article and Find Full Text PDFMar Pollut Bull
July 2024
Department of Chemical Engineering, Indian Institute of Technology (Indian School of Mines), Dhanbad, Jharkhand 826004, India. Electronic address:
The present study aims to combat the problem of oil in water pollution via its separation using a superhydrophobic copper mesh. An ecofriendly superhydrophobic copper mesh with a water contact angle of 166 ± 2° is developed by a facile two-step process (electrodeposition followed by coating). The coated mesh with mechanical robustness, chemical endurance and thermal stability is a promising choice for real-world conditions.
View Article and Find Full Text PDFHeliyon
April 2024
School of Intelligent Equipment Manufacturing, Zhongshan Torch Polytechnic, Zhongshan, 528436, PR China.
Cu-Cu soldering is realized under certain pressure and low temperature conditions by using a surface silver film to modify the copper microlayer structure, thus solving the problems of high thermal stress and signal delay aggravation caused by high temperature in the traditional reflow soldering process. The copper microlayer modified with silver film is obtained by electrodeposition. The surface substructure of the Cu microlayer is a nano cone-shaped protrusion.
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