Removal of Cu(II) ions from contaminated waters using a conducting microfiltration membrane.

J Hazard Mater

State Key Laboratory of Pollution Control and Resource Reuse, School of Environmental Science and Engineering, Tongji University, 1239 Siping Road, Shanghai 200092, China.

Published: October 2017

AI Article Synopsis

  • Researchers developed a new microfiltration membrane by embedding stainless steel in polyvinylidene fluoride to effectively remove Cu(II) ions from contaminated waters.
  • The efficiency of Cu(II) removal increased with higher voltages, with optimal voltages of 1.0V and 2.0V for different concentrations of Cu(II).
  • Long-term tests revealed that the primary removal mechanisms were the electrochemical reduction to Cu(0) and chemical precipitation, along with additional processes like adsorption and electrosorption.

Article Abstract

Efficient removal of toxic metals using low-pressure membrane processes from contaminated waters is an important but challenging task. In the present work, a conducting microfiltration membrane prepared by embedding a stainless steel mesh in the active layer of a polyvinylidene fluoride membrane is developed to remove Cu(II) ions from contaminated waters. Results showed that the conducting membrane had favorable electrochemical properties and stability as cathode. Batch tests showed that Cu(II) removal efficiency increased with the increase of voltages and leveled off with the further enhancement of electric field. The optimal voltages were determined to be 1.0V and 2.0V for the influent Cu(II) concentrations of 5mg/L and 30mg/L, respectively. X-ray photoelectron spectroscopy and X-ray diffraction results demonstrated the presence of Cu(0) and Cu(OH) on the membrane surface. The removal mechanisms involved the intrinsic adsorption of membrane, electrosorption of membrane, adsorption of deposited layer, chemical precipitation of Cu(OH) and deposition of Cu(0) which were aided by electrophoresis and electrochemical oxidation-reduction. Long-term tests showed that the major contributors for Cu(II) removal were the deposition of Cu(0) by electrochemical reduction-oxidation (47.3%±8.5%) and chemical precipitation (41.1%±0.2%), followed by electrosorption, adsorption by the fouling layer and membrane intrinsic sorption.

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http://dx.doi.org/10.1016/j.jhazmat.2017.06.038DOI Listing

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