AI Article Synopsis
- Two-phase liquid-cooling technologies using micro/nanostructured copper or silicon are effective for managing heat in high power electronics, but their reliability under certain conditions is not well understood.
- Accelerated corrosion tests show that copper nanowires corrode in hot water without oxygen, indicating a significant reliability issue.
- The study explores atomic layer deposition (ALD) coatings (TiO and AlO) applied to the nanowires, which successfully preserve their nanoengineered features and provide a solution to the corrosion problem.
Article Abstract
Two-phase liquid-cooling technologies incorporating micro/nanostructured copper or silicon surfaces have been established as a promising thermal management solution to keep up with the increasing power demands of high power electronics. However, the reliability of nanometer-scale features of copper and silicon in these devices has not been well investigated. In this work, accelerated corrosion testing reveals that copper nanowires are not immune to corrosion in deaerated pure hot water. To solve this problem, we investigate atomic layer deposition (ALD) TiO coatings grown at 150 and 175 °C. We measured no difference in coating thickness for a duration of 12 days. Using a core/shell approach, we grow ALD TiO/AlO protective coatings on copper nanowires and demonstrate a preservation of nanoengineered copper features. These studies have identified a critical reliability problem of nanoscale copper and silicon surfaces in deaerated, pure, hot water and have successfully demonstrated a reliable solution using ALD TiO/AlO protective coatings.
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| http://dx.doi.org/10.1021/acsami.6b11963 | DOI Listing |
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