Severity: Warning
Message: file_get_contents(https://...@pubfacts.com&api_key=b8daa3ad693db53b1410957c26c9a51b4908&a=1): Failed to open stream: HTTP request failed! HTTP/1.1 429 Too Many Requests
Filename: helpers/my_audit_helper.php
Line Number: 176
Backtrace:
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 176
Function: file_get_contents
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 250
Function: simplexml_load_file_from_url
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 3122
Function: getPubMedXML
File: /var/www/html/application/controllers/Detail.php
Line: 575
Function: pubMedSearch_Global
File: /var/www/html/application/controllers/Detail.php
Line: 489
Function: pubMedGetRelatedKeyword
File: /var/www/html/index.php
Line: 316
Function: require_once
In this work, chitin (CTN), chitosan (CTS) and activated carbon (AC) were used as adsorbents to recover valuable metals from leachates of mobile phone wastes. The mobile phone wastes (contactors) were collected and characterized. The valuable metals were extracted by thiourea leaching. The adsorption of valuable metals from leachates was studied according to the kinetic and equilibrium viewpoints. It was found that the contactors were composed by Au, Ni, Cu and Sn. The thiourea leaching provided extraction percentages of 68.6% for Au, 22.1% for Ni and 2.8% for Cu. Sn was not extracted. The leachate presented 17.5 mg L of Au, 324.9 mg L of Ni and 573.1 mg L of Cu. The adsorption was fast, being the equilibrium attained within 120 min. The adsorption of Au, Ni and Cu onto CTN and AC followed the Langmuir model, while, the adsorption of these metals onto CTS, followed the Freundlich model. Removal percentages higher than 95% were obtained for all metals, depending of the type and amount of adsorbent. It was demonstrated that the adsorption onto chitin, chitosan and activated carbon can be an alternative to recover valuable metals from leachates of mobile phone wastes.
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Source |
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http://dx.doi.org/10.1016/j.jenvman.2016.11.078 | DOI Listing |
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