Severity: Warning
Message: file_get_contents(https://...@pubfacts.com&api_key=b8daa3ad693db53b1410957c26c9a51b4908&a=1): Failed to open stream: HTTP request failed! HTTP/1.1 429 Too Many Requests
Filename: helpers/my_audit_helper.php
Line Number: 176
Backtrace:
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 176
Function: file_get_contents
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 250
Function: simplexml_load_file_from_url
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 3122
Function: getPubMedXML
File: /var/www/html/application/controllers/Detail.php
Line: 575
Function: pubMedSearch_Global
File: /var/www/html/application/controllers/Detail.php
Line: 489
Function: pubMedGetRelatedKeyword
File: /var/www/html/index.php
Line: 316
Function: require_once
In this study, electrospun polycaprolactone membrane coated with chitosan-silver nanoparticles (CsAg), electrospun polycaprolactone/chitosan/Ag nanoparticles, was fabricated by immersing the plasma-treated electrospun polycaprolactone membrane in the CsAg gel. The plasma modification of electrospun polycaprolactone membrane prior to CsAg coating was tested by methylene blue stain and scanning electron microscope. The presence of silver and chitosan on the plasma-treated electrospun polycaprolactone membrane was confirmed by energy-dispersive X-ray spectroscopy and FT-IR spectrum. Scanning electron microscope observation was employed to observe the morphology of the membranes. The release of Ag ions from electrospun polycaprolactone/chitosan/Ag nanoparticles membrane was tested using atomic absorption spectrometry. Electrospun polycaprolactone/chitosan/Ag nanoparticles membrane inherited advantages from both CsAg gel and electrospun polycaprolactone membrane such as: increasing biocompatibility, mechanical strength, and antibacterial activity against both Gram-negative and Gram-positive bacteria. Thus, this investigation introduces a highly potential membrane that can increase the efficacy of the wound dressing process.
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Source |
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http://dx.doi.org/10.1007/s10856-016-5768-4 | DOI Listing |
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