Ultrathin silicon-based flexible 16 × 16 NAND flash memory (f-NAND) is demonstrated utilizing roll-to-plate packaging. The roll-based thermo-compression bonding of the anisotropic conductive film (ACF) transfers and simultaneously interconnects the f-NAND on a flexible printed circuit board. Reliable circuitry operation of the 16 × 16 f-NAND is confirmed with excellent flexibility and stable ACF interconnections.
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| http://dx.doi.org/10.1002/adma.201602339 | DOI Listing |
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