This paper presents a 4 × V neuro-stimulator in a 0.18- μm 1.8 V/3.3 V CMOS process. The self-adaption bias technique and stacked MOS configuration are used to prevent transistors from the electrical overstress and gate-oxide reliability issue. A high-voltage-tolerant level shifter with power-on protection is used to drive the neuro-stimulator The reliability measurement of up to 100 million periodic cycles with 3000- μA biphasic stimulations in 12-V power supply has verified that the proposed neuro-stimulator is robust. Precise charge balance is achieved by using a novel current memory cell with the dual calibration loops and leakage current compensation. The charge mismatch is down to 0.25% over all the stimulus current ranges (200-300 μA) The residual average dc current is less than 6.6 nA after shorting operation.
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http://dx.doi.org/10.1109/TBCAS.2015.2512443 | DOI Listing |
Sensors (Basel)
January 2025
Institute of Electronics, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.
Single-Photon Avalanche Photodiodes (SPADs) are increasingly utilized in high-temperature-operated, high-performance Light Detection and Ranging (LiDAR) systems as well as in ultra-low-temperature-operated quantum science applications due to their high photon sensitivity and timing resolution. Consequently, the jitter value of SPADs at different temperatures plays a crucial role in LiDAR systems and Quantum Key Distribution (QKD) applications. However, limited studies have been conducted on this topic.
View Article and Find Full Text PDFMicromachines (Basel)
January 2025
College of Electrical and Electronic Engineering, Wenzhou University, Wenzhou 325035, China.
High-precision, low-power MEMS accelerometers are extensively utilized across civilian applications. Closed-loop accelerometers employing switched-capacitor (SC) circuit topologies offer notable advantages, including low power consumption, high signal-to-noise ratio (SNR), and excellent linearity. Addressing the critical demand for high-precision, low-power MEMS accelerometers in modern geophones, this work focuses on the design and implementation of closed-loop interface ASICs (Application-Specific Integrated Circuits).
View Article and Find Full Text PDFMicromachines (Basel)
January 2025
School of Microelectronics, Northwestern Polytechnical University, No. 1 Dongxiang Road, Chang'an District, Xi'an 710129, China.
In low intermediate frequency (low-IF) receivers, image interference rejection is one of the core tasks to be accomplished. Conventional active polyphase filters (APPFs) are unable to have a sufficient image rejection ratio (IRR) at high operating frequencies due to the degradation of the IRR by the amplitude and phase imbalances produced by the secondary pole. The proposed solution to the above problem is a frequency-dependent image rejection enhancement technique based on secondary pole compensation.
View Article and Find Full Text PDFPLoS One
January 2025
Computer Engineering, CCSIT, King Faisal University, Al Hufuf, Kingdom of Saudi Arabia.
This paper presents a low-power, second-order composite source-follower-based filter architecture optimized for biomedical signal processing, particularly ECG and EEG applications. Source-follower-based filters are recommended in the literature for high-frequency applications due to their lower power consumption when compared to filters with alternative topologies. However, they are not suitable for biomedical applications requiring low cutoff frequencies as they are designed to operate in the saturation region.
View Article and Find Full Text PDFNanoscale
January 2025
Department of Chemistry and Materials Science, Tietotie 3, Espoo, 02150, Finland.
Superhydrophobic surfaces are essential in various industries such as textiles, aviation, electronics and biomedical devices due to their exceptional water-repellent properties. Black silicon (b-Si) would be an ideal candidate for some applications due to its nanoscale topography made with a convenient lithography-free step and complementary metal-oxide-semiconductor (CMOS) compatible fabrication process. However, its use is hindered by serious issues with mechanical robustness.
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