We demonstrate GaN-based flip-chip light emitting diodes (FC-LEDs) on SiC substrate achieving high extraction efficiency by simply attaching the optically transparent haze films consisting of collapsed alumina nanorods. Through controlled etching time of alumina nanorods, we obtain four types of films that have different morphologies with different optical transmittance and haze properties. We show that the light output power of the FC-LEDs with film, which has 95.6% transmittance and 62.7% haze, increases by 20.4% in comparison to the bare LEDs. The angular radiation pattern of the LEDs also follows the Lambertian emission pattern without deteriorating the electrical properties of the device. The improvement of light extraction is mainly attributed to the reduced total internal reflection (TIR) via efficient out-coupling of guided light from SiC substrate to air by collapsed alumina nanorod structures in the film. The high transparency of film and reduced Fresnel reflection via graded refractive index transition between the film and SiC substrate also contribute to the extraction enhancement of the device. We systematically investigate the influence of haze film's geometrical or optical properties on the extraction efficiency of FC-LEDs, and this study will provide a novel approach to enhance the performance of various optoelectronic devices.
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http://dx.doi.org/10.1021/acsami.5b07783 | DOI Listing |
Materials (Basel)
December 2024
Carnegie Mellon University, 5000 Forbes Avenue, Pittsburgh, PA 15213, USA.
Arguably, SiC technology is the most rapidly expanding IC manufacturing technology driven mostly by the aggressive roadmap for battery electric vehicle penetration and also industrial high-voltage/high-power applications. This paper provides a comprehensive overview of the state of the art of SiC technology focusing on the challenges starting from the difficult and lengthy SiC substrate growth all the way to the complex MOSFET assembly processes. We focus on the differentiation from the established Si manufacturing processes and provide a comprehensive list of references as well as a brief description of our own research into the key manufacturing processes in this technology.
View Article and Find Full Text PDFNanomaterials (Basel)
December 2024
School of Mechanical and Electrical Engineering, Soochow University, Suzhou 215137, China.
Composite coatings reinforced with varying mass fractions of SiC particles were successfully fabricated on 316 stainless steel substrates via laser cladding. The phase compositions, elemental distribution, microstructural characteristics, hardness, wear resistance and corrosion resistance of the composite coatings were analyzed using X-ray diffraction (XRD), scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDS), Vickers hardness testing, friction-wear testing and electrochemical methods. The coatings have no obvious pores, cracks or other defects.
View Article and Find Full Text PDFMicromachines (Basel)
December 2024
School of Microelectronics, Xidian University, Xi'an 710071, China.
GaN-on-Si high-electron-mobility transistors have emerged as the next generation of high-powered and cost-effective microwave devices; however, the limited thermal conductivity of the Si substrate prevents the realization of their potential. In this paper, a GaN-on-insulator (GNOI) structure is proposed to enhance the heat dissipation ability of a GaN-on-Si HEMT. Electrothermal simulation was carried out to analyze the thermal performance of the GNOI-on-Si HEMTs with different insulator dielectrics, including SiO, SiC, AlN, and diamond.
View Article and Find Full Text PDFSensors (Basel)
December 2024
Institute of Systems Engineering, China Academy of Engineering Physics, Mianyang 621900, China.
Sensors operating in extreme environments are currently a focal point of global research. Extreme environmental conditions, such as overload, vibration, corrosion, high pressure, high temperature, and radiation, can affect the performance of sensors to the point of failure. It is noteworthy that, compared to the resistance to overload and vibration achieved through structural design, the application of sensors under high-temperature and radiation extreme conditions poses a greater challenge.
View Article and Find Full Text PDFMaterials (Basel)
November 2024
Semiconductor Materials Center, Korea Institute of Ceramic Engineering and Technology (KICET), Jinju 52851, Republic of Korea.
A recent study reported the rapid growth of SiC single crystals of ~1.5 mm/h using high-purity SiC sources obtained by recycling CVD-SiC blocks used as materials in semiconductor processes. This method has gained attention as a way to improve the productivity of the physical vapor transport (PVT) method, widely used for manufacturing single crystal substrates for power semiconductors.
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