We demonstrate an ultrahigh speed germanium photodetector by introducing gold wires into the discrete ground electrodes with standard wire bonding technology. To engineer the parasitic parameter, the physical dimension of the gold wire used for wire bonding is specially designed with an inductance of about 450 pH. Simulation and experimental results show that the bandwidth of the photodetector can be effectively extended from less than 30 GHz to over 60 GHz.
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http://dx.doi.org/10.1364/OE.23.025700 | DOI Listing |
J Am Chem Soc
January 2025
Department of Chemistry, University of Alberta, 11227 Saskatchewan Drive, Edmonton, Alberta, Canada T6G 2G2.
Rigid, conjugated molecules are excellent candidates as molecular wires since they can achieve full extension between electrodes while maintaining conjugation. Molecular design can be used to minimize the accessible pi surface and interactions between the bridging wire and the electrode. Polyynes are archetypal molecular wires that feature a rigid molecular framework with a cross-section of a single carbon atom.
View Article and Find Full Text PDFMaterials (Basel)
December 2024
School of Materials Science and Engineering, Tianjin University, Tianjin 300350, China.
Forging additive hybrid manufacturing integrated the high efficiency of forging and the great flexibility of additive manufacturing, which has significant potential in the construction of reactor pressure vessels (RPVs). In the components, the heat-affected zone (HAZ, also called as bonding zone) between the forged substrate zone and the arc deposition zone was key to the final performance of the components. In this study, the Mn-Mo-Ni welding wire was deposited on the 16MnD5 substrate with a submerged arc heat source.
View Article and Find Full Text PDFMicromachines (Basel)
December 2024
School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China.
This article conducts wire bonding tests and cold/hot-cycle tests using φ 0.025 mm Ag-Au alloy wires and Ag-Au-Pd alloy wires with different specifications. The results show that, due to the addition of the alloying element Pd, under the same bonding parameters, the fracture strength and ball-bonded point shear force of the Ag-Au-Pd alloy wires are significantly higher than those of the Ag-Au alloy wires.
View Article and Find Full Text PDFTurk J Orthod
December 2024
Trakya University Faculty of Dentistry, Department of Orthodontics, Edirne, Turkey.
Objective: This study aims to compare the impact of titanium and stainless steel (SS) retainer wires on lower incisor stability and periodontal health.
Methods: Fifty patients between the ages of 14.1 and 29.
Sensors (Basel)
November 2024
Institute of Electrodynamics, Microwave and Circuit Engineering, TU Wien, Gusshausstrasse 25/E354-02, A-1040 Wien, Austria.
It is shown that the integration of a single-photon avalanche diode (SPAD) together with a BiCMOS gating circuit on one chip reduces the parasitic capacitance a lot and therefore reduces the avalanche build-up time. The capacitance of two bondpads, which are necessary for the connection of an SPAD chip and a gating chip, are eliminated by the integration. The gating voltage transients of the SPAD are measured using an integrated mini-pad and a picoprobe.
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