Cleavable Ligands Enable Uniform Close Packing in Colloidal Quantum Dot Solids.

ACS Appl Mater Interfaces

The Edward S. Rogers Department of Electrical and Computer Engineering, University of Toronto , 10 King's College Road, Toronto, Ontario M5S 3G4, Canada.

Published: October 2015

Uniform close packing in colloidal quantum dot solids is critical for high-optical density, high-mobility optoelectronic devices. A hybrid-ligand strategy is developed, combining the advantages of solid state and solution-phase ligand exchanges. This strategy uses a medium length thioamide ligand that is readily cleaved in a single chemical treatment, leading to quantum dot solids with uniformly packed domains 3 times larger than those observed in ligand-exchanged films.

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Source
http://dx.doi.org/10.1021/acsami.5b06890DOI Listing

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