We report on gallium droplet nucleation on silicon (100) substrates with and without the presence of the native oxide. The gallium deposition is carried out under ultra-high vacuum conditions at temperatures between 580 and 630 °C. The total droplet volume, obtained from a fit to the diameter-density relation, is used for sample analysis on clean silicon surfaces. Through a variation of the 2D equivalent Ga thickness, the droplet diameter was found to be between 250-1000 nm. Longer annealing times resulted in a decrease of the total droplet volume. Substrate temperatures of 630 °C and above led to Ga etching into the Si substrates and caused Si precipitation around the droplets. In contrast, we obtained an almost constant diameter distribution around 75 nm over a density range of more than two orders of magnitude in the presence of a native oxide layer. Furthermore, the droplet nucleation was found to correlate with the density of surface features on the 'epi-ready' wafer.
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