In this letter, the uniform 4H silicon carbide (SiC) mesopores was fabricated by pulsed electrochemical etching method. The length of the mesopores is about 19 μm with a diameter of about 19 nm. The introduction of pause time (T off) is crucial to form the uniform 4H-SiC mesopores. The pore diameter will not change if etching goes with T off. The hole concentration decreasing at the pore tips during the T off is the main reason for uniformity.
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http://dx.doi.org/10.1186/1556-276X-9-570 | DOI Listing |
Materials (Basel)
May 2024
Key Laboratory of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China.
In this study, we systematically explore the impact of C/Si ratio, pre-carbonization time, H etching time, and growth pressure on the buffer layer and subsequent epitaxial layer of 6-inch 4H-SiC wafers. Our findings indicate that the buffer layer's C/Si ratio and growth pressure significantly influence the overall quality of the epitaxial wafer. Specifically, an optimal C/Si ratio of 0.
View Article and Find Full Text PDFMicromachines (Basel)
April 2024
Key Laboratory of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China.
In this study, a 4H-SiC homoepitaxial layer was grown on a 150 mm 4° off-axis substrate using a horizontal hot wall chemical vapor deposition reactor. Comparing CH and CH as C sources, the sample grown with CH exhibited a slower growth rate and lower doping concentration, but superior uniformity and surface roughness compared to the CH-grown sample. Hence, CH is deemed more suitable for commercial epitaxial wafer growth.
View Article and Find Full Text PDFRSC Adv
May 2024
Key Laboratory of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences Beijing 100083 People's Republic of China
In this study, the epitaxial growth of 6-inch n-type 4° off-axis -face substrates using a horizontal hot-wall LPCVD system was investigated. The study explored the epitaxial growth under different source gas flow rates, growth pressures, and pre-etching times, with particular emphasis on their effects on epitaxial growth rate, epitaxial layer thickness uniformity, doping concentration and uniformity, and epitaxial layer surface roughness. The observation was made that the increase in source gas flow rate led to variations in dopant concentration due to different transport models between nitrogen gas and source gas.
View Article and Find Full Text PDFAdv Mater
November 2023
Department of Materials Science and Nanoengineering, Rice University, Houston, TX, 77005, USA.
Nanomaterials (Basel)
July 2023
Center for Composite Materials and Structures, Harbin Institute of Technology, Harbin 150080, China.
Silicon carbide (SiC) is a promising material for thermoelectric power generation. The characterization of thermal transport properties is essential to understanding their applications in thermoelectric devices. The existence of stacking faults, which originate from the "wrong" stacking sequences of Si-C bilayers, is a general feature of SiC.
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