We report on the design and characterization of a single-chip electron spin resonance detector, operating at a frequency of about 20 GHz and in a temperature range extending at least from 300 K down to 4 K. The detector consists of an LC oscillator formed by a 200 μm diameter single turn aluminum planar coil, a metal-oxide-metal capacitor, and two metal-oxide-semiconductor field effect transistors used as negative resistance network. At 300 K, the oscillator has a frequency noise of 20 Hz/Hz(1/2) at 100 kHz offset from the 20 GHz carrier. At 4 K, the frequency noise is about 1 Hz/Hz(1/2) at 10 kHz offset. The spin sensitivity measured with a sample of DPPH is 10(8)spins/Hz(1/2) at 300 K and down to 10(6)spins/Hz(1/2) at 4 K.
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http://dx.doi.org/10.1016/j.jmr.2014.08.013 | DOI Listing |
Small
January 2025
Department of Microelectronics, Faculty of Electrical Engineering, Mathematics and Computer Science, Delft University of Technology, Delft, 2628 CN, The Netherlands.
Miniaturization of next-generation active neural implants requires novel micro-packaging solutions that can maintain their long-term coating performance in the body. This work presents two thin-film coatings and evaluates their biostability and in vivo performance over a 7-month animal study. To evaluate the coatings on representative surfaces, two silicon microchips with different surface microtopography are used.
View Article and Find Full Text PDFNpj Flex Electron
October 2024
Thayer School of Engineering, Dartmouth College, Hanover, NH, 03755, USA.
The integration of flexible electronics and photonics has the potential to create revolutionary technologies, yet it has been challenging to marry electronic and photonic components on a single polymer device, especially through high-volume manufacturing. Here, we present a robust, chiplet-level heterogeneous integration of polymer-based circuits (CHIP), where several post-fabricated, ultrathin, polymer electronic, and optoelectronic chiplets are vertically bonded into one single chip at room temperature and then shaped into application-specific form factors with monolithic Input/Output (I/O). As a demonstration, we applied this process and developed a flexible 3D-integrated optrode with high-density arrays of microelectrodes for electrical recording and micro light-emitting diodes (μLEDs) for optogenetic stimulation while with unprecedented integration of additional temperature sensors for bio-safe operations and shielding designs for optoelectronic artifact prevention.
View Article and Find Full Text PDFAnal Chem
September 2024
Institute of Electrical and Micro Engineering (IEM) & Center for Quantum Science and Engineering (QSE) École Polytechnique Fédérale de Lausanne (EPFL), Lausanne CH-1015, Switzerland.
We report on the design and characterization of a single chip integrated pulsed electron spin resonance detector operating at 9.1 GHz. The microsystem consists of an excitation microcoil, a detection microcoil, a low noise microwave preamplifier, a mixer, and an intermediate frequency (IF) amplifier.
View Article and Find Full Text PDFJ Synchrotron Radiat
September 2024
Deutsches Elektronen-Synchrotron DESY, Notkestrasse 85, 22607 Hamburg, Germany.
Adv Mater
August 2024
School of Physical Science and Technology, Jiangsu Key Laboratory of Frontier Material Physics and Devices, Center for Energy Conversion Materials & Physics (CECMP), Soochow University, Suzhou, 215006, China.
Color-selective photodetectors (PDs) play an indispensable role in spectral recognition, image sensing, and other fields. Nevertheless, complex filters and delicate optical paths in such devices significantly increase their complexity and size, which subsequently impede their integration in smart optoelectronic chips for universal applications. This work demonstrates the successful fabrication of filter-less color-selective perovskite PDs by integrating three perovskite units with different photoresponse on a single chip.
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