Direct optical mapping of anisotropic stresses in nanowires using transverse optical phonon splitting.

Strain engineering is ubiquitous in the design and fabrication of innovative, high-performance electronic, optoelectronic, and photovoltaic devices. The increasing importance of strain-engineered nanoscale materials has raised significant challenges at both fabrication and characterization levels. Raman scattering spectroscopy (RSS) is one of the most straightforward techniques that have been broadly utilized to estimate the strain in semiconductors. However, this technique is incapable of measuring the individual components of stress, thus only providing the average values of the in-plane strain. This inherit limitation severely diminishes the importance of RSS analysis and makes it ineffective in the predominant case of nanostructures and devices with a nonuniform distribution of strain. Herein, we circumvent this major limitation and demonstrate for the first time the application of RSS to simultaneously probe the two local stress in-plane components in individual ultrathin silicon nanowires based on the imaging of the splitting of the two forbidden transverse optical phonons.