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Bond strength between composite resin and resin modified glass ionomer using different adhesive systems and curing techniques. | LitMetric

Aim: To evaluate bond strength between RMGI and composite using different adhesive systems and curing techniques.

Materials And Methods: Sixty prepared samples of RMGI were randomly divided into six groups according to adhesive systems (total-etch, two-step self-etch and all-in-one) and curing techniques (co-curing and pre-curing). In co-curing technique, the adhesive systems were applied on uncured RMGI samples and co-cured together. In the pre-curing technique, before application of adhesive systems, the RMGI samples were cured. Composite layers were applied and shear bond strength was measured. Two samples of each group were evaluated by SEM. Failure mode was determined by streomicroscope.

Results: Both curing methods and adhesive systems had significant effect on bond strength (P-value < 0.05). There was an interaction between two factors (P-value <0.05). Both self-etch adhesives had significantly higher shear bond strength than the total-etch adhesive (P-value <0.05). The co-curing technique improved the bond strength in self-etch adhesives, but decreased the bond strength in total-etch adhesive (P-value<0.05).

Conclusion: The application of self-etch adhesive systems and co-curing technique can improve the bond strength between the RMGI and composite.

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Source
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC4001272PMC
http://dx.doi.org/10.4103/0972-0707.128055DOI Listing

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