Thermal properties of graphene-copper-graphene heterogeneous films.

Nano Lett

Nano-Device Laboratory, Department of Electrical Engineering, Bourns College of Engineering, University of California - Riverside, Riverside, California 92521, United States.

Published: March 2014

We demonstrated experimentally that graphene-Cu-graphene heterogeneous films reveal strongly enhanced thermal conductivity as compared to the reference Cu and annealed Cu films. Chemical vapor deposition of a single atomic plane of graphene on both sides of 9 μm thick Cu films increases their thermal conductivity by up to 24% near room temperature. Interestingly, the observed improvement of thermal properties of graphene-Cu-graphene heterofilms results primarily from the changes in Cu morphology during graphene deposition rather than from graphene's action as an additional heat conducting channel. Enhancement of thermal properties of graphene-capped Cu films is important for thermal management of advanced electronic chips and proposed applications of graphene in the hybrid graphene-Cu interconnect hierarchies.

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Source
http://dx.doi.org/10.1021/nl404719nDOI Listing

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