The effect of iron spin transition on electrical conductivity of (Mg,Fe)O magnesiowüstite.

Proc Jpn Acad Ser B Phys Biol Sci

Department of Earth and Planetary Sciences, Tokyo Institute of Technology, Tokyo, Japan .

Published: May 2007

We measured the electrical conductivity of Mg0.81Fe0.19O magnesiowüstite, one of the important minerals comprising Earth's lower mantle, at high pressures up to 135 GPa and 300 K in a diamond-anvil cell (DAC). The results demonstrate that the electrical conductivity increases with increasing pressure to about 60 GPa and exhibits anomalous behavior at higher pressures; it conversely decreases to around 80 GPa and again increases very mildly with pressure. These observed changes may be explained by the high-spin to low-spin transition of iron in magnesiowüstite that was previously reported to occur in a similar pressure range. A very small pressure effect on the electrical conductivity above 80 GPa suggests that a dominant conduction mechanism changes by this electronic spin transition. The electrical conductivity below 2000-km depth in the mantle may be much smaller than previously thought, since the spin transition takes place also in (Mg,Fe)SiO3 perovskite.

Download full-text PDF

Source
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC3756880PMC
http://dx.doi.org/10.2183/pjab.83.97DOI Listing

Publication Analysis

Top Keywords

electrical conductivity
20
spin transition
12
transition electrical
8
electrical
5
conductivity
5
iron spin
4
transition
4
conductivity mgfeo
4
mgfeo magnesiowüstite
4
magnesiowüstite measured
4

Similar Publications

Single-crystal Au(111), renowned for its chemically inert surface, long-range "herringbone" reconstruction, and high electrical conductivity, has long served as an exemplary template in diverse fields, , crystal epitaxy, electronics, and electrocatalysis. However, commercial Au(111) products are high-priced and limited to centimeter sizes, largely restricting their broad applications. Herein, a low-cost, high-reproducible method is developed to produce 4 in.

View Article and Find Full Text PDF

Background: The phase angle (PhA) in bioelectrical impedance analysis (BIA) reflects the cell membrane integrity or body fluid equilibrium. We examined how the PhA aligns with previously known markers of acute heart failure (HF) and assessed its value as a screening tool.

Methods: PhA was measured in 50 patients with HF and 20 non-HF controls along with the edema index (EI), another BIA parameter suggestive of edema.

View Article and Find Full Text PDF

This study employs electrical resistivity tomography (ERT) to experimentally investigate the migration characteristics of light non-aqueous phase liquids (LNAPL) under various groundwater conditions. Through cross-hole measurements and time-lapse inversion, the migration process of LNAPL under three scenarios-unsaturated conditions, constant groundwater levels, and declining water levels-was systematically analyzed. The results indicate that LNAPL migration behavior exhibits significant differences under different conditions.

View Article and Find Full Text PDF

Metalgel Fiber with Excellent Electrical and Mechanical Properties.

ACS Appl Mater Interfaces

January 2025

National Laboratory of Solid State Microstructures, College of Engineering and Applied Sciences, Nanjing University, Nanjing 210023, China.

With the rapid advancement of soft electronics, particularly the rise of fiber electronics and smart textiles, there is an urgent need to develop high-performance fiber materials with both excellent electrical and mechanical properties. However, existing fiber materials including metal fibers, carbon-based fibers, intrinsically conductive polymer fibers, and composite fibers struggle to simultaneously meet the requirements. Here, we introduce a metalgel fiber with a unique structure.

View Article and Find Full Text PDF

Bulk thermally conductive polyethylene as a thermal interface material.

Mater Horiz

January 2025

Sibley School of Mechanical and Aerospace Engineering, Cornell University, Ithaca, New York 14853, USA.

As the demand for high-power-density microelectronics rises, overheating becomes the bottleneck that limits device performance. In particular, the heterogeneous integration architecture can magnify the importance of heat dissipation and necessitate electrical insulation between critical junctions to prevent dielectric breakdown. Consequently, there is an urgent need for thermal interface materials (TIMs) with high thermal conductivity and electrical insulation to address this challenge.

View Article and Find Full Text PDF

Want AI Summaries of new PubMed Abstracts delivered to your In-box?

Enter search terms and have AI summaries delivered each week - change queries or unsubscribe any time!