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http://dx.doi.org/10.1002/anie.201303216 | DOI Listing |
Nanotechnology
January 2025
Muhayil Asir, Applied College, King Khalid University, Abha 62529, Saudi Arabia.
Molecules
November 2024
Faculty of Metallurgical and Energy Engineering/National Engineering Research Center of Vacuum Metallurgy, Kunming University of Science and Technology, Kunming 650093, China.
The photovoltaic (PV) industry is developing rapidly to support energy transformation and emission reduction. In the whole PV industry chain, diamond wire saw silicon powder (DWSSP) waste is the most promising secondary resource for recycling high-purity silicon. DWSSP mainly contains metal impurities, and the treatment process based on hydrometallurgy can effectively remove metal impurities.
View Article and Find Full Text PDFChemphyschem
November 2024
Faculty of Chemistry, University of Warsaw, Pasteura 1, 02-093, Warsaw, Poland.
Herein, we propose a purely-organic donor-acceptor (D-A) molecular triad, with a light-absorbing polarized molecular wire (PMW) used as a central linkage, as a proof of concept for the possible future applications of the D-PMW-A arrangement in molecular photovoltaics. This work builds upon our earlier study on the PMW unit itself, which proved to be highly promising for the ultrafast photogeneration of free charge carriers. Quantum-chemical calculations performed for the D-PMW-A triad at a semi-empirical level of theory reveal a large electric dipole moment of the system, and show strong charge-transfer (CT) character of its lowest-energy excited electronic states, including the , which favours efficient dissociation of an exciton initially formed upon the absorption of light.
View Article and Find Full Text PDFMicromachines (Basel)
July 2024
College of Mechanical and Vehicle Engineering, Taiyuan University of Technology, Taiyuan 030024, China.
Thin wafers and thin wires are beneficial to the photovoltaic industry for reducing costs, increasing efficiency, and reducing the cost of electricity generation. It is a development trend in solar silicon wafer cutting. Thin wire cutting reduces the kerf between silicon wafers to less than 50 μm.
View Article and Find Full Text PDFHeliyon
February 2024
Department of Mechanical Engineering, College of Engineering, King Khalid University, Asir-Abha, 61421, Saudi Arabia.
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