Commonly, materials are classified as either electrical conductors or insulators. The theoretical discovery of topological insulators has fundamentally challenged this dichotomy. In a topological insulator, the spin-orbit interaction generates a non-trivial topology of the electronic band structure dictating that its bulk is perfectly insulating, whereas its surface is fully conducting. The first topological insulator candidate material put forward--graphene--is of limited practical use because its weak spin-orbit interactions produce a bandgap of ~0.01 K. Recent reexaminations of Bi2Se3 and Bi2Te3, however, have firmly categorized these materials as strong three-dimensional topological insulators. We have synthesized the first bulk material belonging to an entirely different, weak, topological class, built from stacks of two-dimensional topological insulators: Bi14Rh3I9. Its Bi-Rh sheets are graphene analogues, but with a honeycomb net composed of RhBi8 cubes rather than carbon atoms. The strong bismuth-related spin-orbit interaction renders each graphene-like layer a topological insulator with a 2,400 K bandgap.
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http://dx.doi.org/10.1038/nmat3570 | DOI Listing |
ACS Nano
January 2025
Peter Grünberg Institut (PGI-9), Forschungszentrum Jülich, 52425 Jülich, Germany.
The combination of an ordinary s-type superconductor with three-dimensional topological insulators creates a promising platform for fault-tolerant topological quantum computing circuits based on Majorana braiding. The backbone of the braiding mechanism are three-terminal Josephson junctions. It is crucial to understand the transport in these devices for further use in quantum computing applications.
View Article and Find Full Text PDFNano Lett
January 2025
Institut für Festkörperelektronik, Technische Universität Wien, Gußhausstraße 25, 1040 Vienna, Austria.
We synthesized and spectroscopically investigated monolayer (ML) C on the topological insulator (TI) BiTe. This C/BiTe heterostructure is characterized by an excellent translational order in a novel (4 × 4) C superstructure on a (9 × 9) cell of BiTe. Angle-resolved photoemission spectroscopy (ARPES) of C/BiTe reveals that ML C accepts electrons from the TI at room temperature, but no charge transfer occurs at low temperatures.
View Article and Find Full Text PDFACS Mater Au
January 2025
Center for Advanced Materials Research, Research Institute of Sciences and Engineering, University of Sharjah, Sharjah 27272, United Arab Emirates.
Topological quantum materials hold great promise for future technological applications. Their unique electronic properties, such as protected surface states and exotic quasi-particles, offer opportunities for designing novel electronic and spintronics devices and allow quantum information processing. The origin of the interplay between various electronic orders in topological quantum materials, such as superconductivity and magnetism, remains unclear, particularly whether these electronic orders cooperate, compete, or simply coexist.
View Article and Find Full Text PDFNano Lett
January 2025
Department of Physics and Astronomy, University of Utah, Salt Lake City, Utah 84112, United States.
The antiferromagnetic topological insulator MnBiTe (MBT) exhibits an ideal platform for investigating unique topological and magnetic properties. While the transport characteristics of magnetic phase transitions in the MBT materials have been extensively studied, the understanding of their mechanical properties and magneto-mechanical coupling remains limited. Here, we utilize nanoelectromechanical systems to probe the intrinsic magnetism in MBT thin flakes through magnetostrictive coupling.
View Article and Find Full Text PDFACS Appl Mater Interfaces
January 2025
Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, Pennsylvania 15213, United States.
Majorana zero modes are predicted to emerge in semiconductor/superconductor interfaces, such as InAs/Al. Majorana modes could be utilized for fault tolerant topological qubits. However, their realization is hindered by materials challenges.
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