Metals are used in a variety of ways, many of which lead to dissipative releases to the environment. Such releases are relevant from both a resource use and an environmental impact perspective. We present a historical analysis of copper dissipative releases in the United States from 1975 to 2000. We situate all dissipative releases in copper's life cycle and introduce a conceptual framework by which copper dissipative releases may be categorized in terms of intentionality of use and release. We interpret our results in the context of larger trends in production and consumption and government policies that have served as drivers of intentional copper releases from the relevant sources. Intentional copper releases are found to be both significant in quantity and highly variable. In 1975, for example, the largest source of intentional releases was from the application of copper-based pesticides, and this decreased more than 50% over the next 25 years; all other sources of intentional releases increased during that period. Overall, intentional copper releases decreased by approximately 15% from 1975 to 2000. Intentional uses that are unintentionally released such as copper from roofing, increased by the same percentage. Trace contaminant sources such as fossil fuel combustion, i.e., sources where both the use and the release are unintended, increased by nearly 50%. Intentional dissipative uses are equivalent to 60% of unintentional copper dissipative releases and more than five times that from trace sources. Dissipative copper releases are revealed to be modest when compared to bulk copper flows in the economy, and we introduce a metric, the dissipation index, which may be considered an economy-wide measure of resource efficiency for a particular substance. We assess the importance of dissipative releases in the calculation of recycling rates, concluding that the inclusion of dissipation in recycling rate calculations has a small, but discernible, influence, and should be included in such calculations.
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http://dx.doi.org/10.1016/j.scitotenv.2011.09.075 | DOI Listing |
Adv Mater
January 2025
School of Electric Power Engineering, South China University of Technology, Guangzhou, 510641, China.
Self-adaptive dielectrics (SADs), with the characteristics of rapid charge dissipation in electric field distortion, is regarded as the future material for package insulation of advanced electronic devices. The current landscape of SADs is incapable to achieve tunable nonlinear electrical conductivity and threshold field strength due to the inherent Schottky barrier, significantly limiting the application scenarios of SADs. Here, a strategy is reported to construct a stepped Schottky barrier through virus-like structures, which are composed of subminiature metal particles and semiconductor microspheres.
View Article and Find Full Text PDFPlants (Basel)
December 2024
Plant Physiology, Pharmaceutical and Health Sciences Department, Faculty of Pharmacy, San Pablo-CEU Universities, 28668 Boadilla del Monte, Spain.
An alkaline pH in soils reduces Fe availability, limiting Fe uptake, compromising plant growth, and showing chlorosis due to a decrease in chlorophyll content. To achieve proper Fe homeostasis, dicotyledonous plants activate a battery of strategies involving not only Fe absorption mechanisms, but also releasing phyto-siderophores and recruiting siderophore-producing bacterial strains. A screening for siderophore-producing bacterial isolates from the rhizosphere of was carried out, resulting in two strains, Z8.
View Article and Find Full Text PDFMaterials (Basel)
December 2024
Department of Materials Science and Technology, Tokyo University of Science, 6-3-1, Niijuku Katsushika-ku, Tokyo 125-8585, Japan.
Accurately predicting fatigue failure in CFRP laminates requires an understanding of the cyclic behavior of their resin matrix, which plays a crucial role in the materials' overall performance. This study focuses on the temperature elevation during the cyclic loadings of the resin, driven by inelastic deformations that increase the dissipated energy. At low loading frequencies, the dissipated energy is effectively released as heat, preventing significant temperature rise and maintaining a consistent, balanced thermal state.
View Article and Find Full Text PDFHeliyon
December 2024
Institute of Chemical Technologies and Analytics CTA, TU Wien, Getreidemarkt 9/164, 1060, Vienna, Austria.
Adhesion at the interface between dissimilar materials in the semiconductor industry is an important topic, but reliable quantitative methods for strongly adhesive or highly plastic layers are hardly available. This study aims to investigate the suitability of the cross-sectional nanoindentation (CSN) method for determination of the critical energy release rate of thin film stacks in the presence of a polyimide layer as a representative structure for such a case. For this purpose, the adhesion of a deliberately weakened Si/SiO interface in a Si/SiO/Al/SiN/polyimide stack is examined by systematic variation of the experimental parameters.
View Article and Find Full Text PDFAdv Mater
January 2025
Department of Orthopaedics Shanghai Key Laboratory for Prevention and Treatment of Bone and Joint Diseases, Shanghai Institute of Traumatology and Orthopaedics, Ruijin Hospital, Shanghai Jiao Tong University School of Medicine, 197 Ruijin 2nd Road, Shanghai, 200025, P. R. China.
High transductive loss at tissue injury sites impedes repair. The high dissipation characteristics in the electromechanical conversion of piezoelectric biomaterials pose a challenge. Therefore, supramolecular engineering and microfluidic technology is utilized to introduce slide-ring polyrotaxane and conductive polypyrrole to construct stress-electric coupling hydrogel microspheres.
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