Microbial fuel cells (MFCs) could potentially be utilized for a variety of applications in the future from biosensors to wastewater treatment. However, the amount of costly platinum (Pt) used as a catalyst should be minimized via innovative deposition methods such as sputtering. In addition, alternative and low-cost catalysts, such as cobalt (Co), should be sought. In this study, ultra low Pt or Co cathodes (0.1 mg cm(-2)) were manufactured by plasma sputtering deposition and scanning electron micrographs revealed nano-clusters of metal catalyst in a porous structure favorable to the three-phase heterogeneous catalytic reaction. When operated in single-chamber air-cathode MFCs, sputtered-Co cathodes generated on average the same power as sputtered-Pt cathodes (0.27 mW cell(-1)) and only 27% less than conventional Pt-ink cathodes with a catalyst load 5 times higher (0.5 mg cm(-2)). Finally, microscopy and molecular analyses showed evidence of biocatalysis activity on metal-free cathodes.
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http://dx.doi.org/10.1016/j.bios.2011.10.009 | DOI Listing |
Anal Chem
January 2025
Cigar Technology Innovation Center of China Tobacco, Cigar Fermentation Technology Key Laboratory of China Tobacco (China Tobacco Sichuan Industrial Co., Ltd.), Chengdu 610066, People's Republic of China.
This study developed a portable arc iKnife ionization mass spectrometry (AII-MS) technique integrating a surgical knife with low-temperature arc plasma to interact with plant tissues. The thermal energy from the arc plasma induces the sputtering of water-containing plant tissues, leading to the formation of aerosols. These aerosols are then charged by plasma-generated ions, producing charged microdroplets that are ultimately detected by a mass spectrometer.
View Article and Find Full Text PDFACS Appl Mater Interfaces
January 2025
Advanced Research Institute of Multidisciplinary Sciences, Beijing Institute of Technology, Beijing 100081, China.
Faraday cages are extensively utilized in plasma-based etching and deposition processes to regulate ion behavior due to their shielding effect on electromagnetic fields. Herein, vertical silicon nanopillar arrays are fabricated through SF and O reactive ion etching. By incorporation of a Faraday cage in the plasma equipment, the impact of the Faraday cage on the morphology of the silicon nanopillars is analyzed; the Faraday cage blocks out the sputtered particles and eradicates the formation of silicon nanograss.
View Article and Find Full Text PDFACS Catal
January 2025
Department of Surface and Plasma Science, Faculty of Mathematics and Physics, Charles University, V Holešovičkách 2, 180 00 Prague 8, Czech Republic.
Achieving the optimal balance between cost-efficiency and stability of oxygen reduction reaction (ORR) catalysts is currently among the key research focuses aiming at reaching a broader implementation of proton-exchange membrane fuel cells (PEMFCs). To address this challenge, we combine two well-established strategies to enhance both activity and stability of platinum-based ORR catalysts. Specifically, we prepare ternary PtNi-Au alloys, where each alloying element plays a distinct role: Ni reduces costs and boosts ORR activity, while Au enhances stability.
View Article and Find Full Text PDFChemistry
January 2025
Technical and Macromolecular Chemistry, Paderborn University, Warburger Str. 100, 33098, Paderborn, Germany.
Self-assembled DNA origami lattices on silicon oxide surfaces have great potential to serve as masks in molecular lithography. However, silicon oxide surfaces come in many different forms and the type and history of the silicon oxide has a large effect on its physicochemical surface properties. Therefore, we here investigate DNA origami lattice formation on differently fabricated SiO films on silicon wafers after wet-chemical oxidation by RCA1.
View Article and Find Full Text PDFMicromachines (Basel)
November 2024
School of Integrative Engineering, Chung-Ang University, 84, Heukseok-ro, Dongjak-gu, Seoul 06974, Republic of Korea.
We examined how controlling variables in a pre-metallization Ar sputter-etching process for in situ contact-hole cleaning affects the contact-hole profile, etching rate, and substrate damage. By adjusting process parameters, we confirmed that increasing plasma power lowered the DC bias but enhanced the etching rate of SiO, while increasing RF power raised both, with RF power having a more pronounced effect. Higher Ar flow rate reduced etching uniformity and slightly lowered the DC bias.
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