High-photosensitive resin for super-resolution direct-laser-writing based on photoinhibited polymerization.

Opt Express

Centre for Micro-Photonics, Faculty of Engineering and Industrial Science, Swinburne University of Technology, P.O. Box 218 Hawthorn, VIC 3122, Australia.

Published: September 2011

AI Article Synopsis

  • An ethoxylated bis-phenol-A dimethacrylate photoresin (BPE-100) is developed for creating features smaller than 50 nm using direct laser writing.
  • The technique leverages overlapping laser beams of different wavelengths to fine-tune photoinitiating and photoinhibiting processes during polymerization, leading to super-resolution effects.
  • BPE-100 achieves significant milestones with the creation of 40 nm dots and a minimum linewidth of 130 nm, with performance metrics aligning well with predictive simulations based on a non-steady-state kinetic model.

Article Abstract

An ethoxylated bis-phenol-A dimethacrylate based photoresin BPE-100 of relatively high photosensitivity and modulus is used for the creation of sub-50 nm features. This is achieved by using the direct laser writing technique based on the single-photon photoinhibited polymerization. The super-resolution feature is realized by overlapping two laser beams of different wavelengths to enable the wavelength-controlled activation of photoinitiating and photoinhibiting processes in the polymerization. The increased photosensitivity of the photoresin promotes a fast curing speed and enhances the photopolymerization efficiency. Using the photoresin BPE-100, we achieve 40 nm dots for the first time in the super-resolution fabrication technique based on the photoinhibited polymerization, and a minimum linewidth of 130 nm. The influence of the power of the inhibiting laser and the exposure time on the feature size is studied and the results agree well with the prediction obtained from a simulation based on a non-steady-state kinetic model.

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http://dx.doi.org/10.1364/OE.19.019486DOI Listing

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