Carbon nanotubes (CNTs) have advantages as conductive fillers due to their large aspect ratio and excellent conductivity. In this study, a novel silver/conducting polymer composite was developed by the incorporation of silver-plated CNTs. It is important to achieve a homogeneous dispersion of nanotubes and to improve the interfacial bonding to utilize the excellent properties of reinforcements in the matrix material. The homogeneous dispersion of nanotubes was achieved by an acid treatment process, and the interfacial contact was improved by electroless silver plating around nanotubes. The resistivity of the silver/conducting polymer composite was decreased by 83% by the addition of silver-plated single-walled carbon nanotubes. Conductive bumps were also screen-printed to demonstrate the capability of the composite as electrical interconnects for multi-layer printed circuit boards.
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http://dx.doi.org/10.1088/0957-4484/19/49/495602 | DOI Listing |
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