Analogous mechanical behaviors in [Formula: see text] and [Formula: see text] directions of Cu nanowires under tension and compression at a high strain rate.

This study analyzes the plastic deformation on the atomic scale of Cu nanowires (NWs) with [Formula: see text] and [Formula: see text] orientations during uniaxial tension and compression, using a molecular dynamic simulation. The maximum local stress (MLS) method is employed to evaluate mechanical behavior during deformation. Following yielding, the flow stress strongly depends on the variation in the degree of orientation caused by twinning. Both the tension of the [Formula: see text] NW and the compression of the [Formula: see text] NW cause twin deformation and consequent geometrical softening. In contrast, the compression of the [Formula: see text] NW and the tension of the [Formula: see text] NW form twin bands and cause geometrical hardening. These behaviors result in the stress-strain curves that reveal the pseudo-skew-symmetry characteristic. With respect to the difference between the critical resolved shear stress (τ(c)) associated with the distinct orientations, τ(c) depends strongly on the surface critical resolved stress (τ(sc)). Under tension, τ(sc) depends on the degree of lattice distortion. A larger lattice distortion (pre-tensile stress) corresponds to higher τ(sc). However, under compression, a geometrical factor can be used to describe the difference in τ(sc) between the different orientations. A larger geometrical factor corresponds to a larger τ(sc).