Nanoindentation characteristics of clamped freestanding Cu membranes.

Nanotechnology

Department of Engineering Science, National Cheng Kung University, 1 University Road, Tainan 701, Taiwan. Stress-Reliability Laboratory, Advanced Semiconductor Engineering Incorporated, Kaohsiung 811, Taiwan.

Published: April 2007

This research employed instrumented nanoindentation to address the issue of bending to stretching-induced deformation of clamped freestanding Cu membranes. The experimental results show that indentation-induced plastic deformation only comes into effect at the centre and the indented edge of the Cu membrane when the indenter is applied, while the other locations remain undamaged. A step-by-step evolution was presumed for the time histories of the bending to stretching-induced deformation and for the timing of the significant change in slope of the load-deflection curve. Deformation was deliberately introduced at the transition from the single-point bending indentation to the surface stretching indentation at the impact location touched with the indenter. Good elastic recovery was found at locations away from the indenter. A similar finding can be arrived at by means of finite element analysis.

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Source
http://dx.doi.org/10.1088/0957-4484/18/13/135701DOI Listing

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