Thermal expansion coefficients of obliquely deposited MgF2 thin films and their intrinsic stress.

Appl Opt

Department of Optoelectronic System Engineering, Minghsin University of Science and Technology, Hsin-Chu 304, Taiwan.

Published: March 2011

AI Article Synopsis

  • The study investigates how columnar and deposition angles affect the thermal expansion and stress behaviors of MgF2 films with columnar structures.
  • The research employs a phase-shifting Twyman-Green interferometer to measure temperature-related stress behaviors in the films.
  • Results show that MgF2 films have larger thermal expansion coefficients than glass substrates, and exhibit compressive intrinsic stress alongside tensile thermal stress, highlighting the importance of angle variations in these properties.

Article Abstract

This study elucidates the effects of columnar angles and deposition angles on the thermal expansion coefficients and intrinsic stress behaviors of MgF2 films with columnar microstructures. The behaviors associated with temperature-dependent stresses in the MgF2 films are measured using a phase-shifting Twyman-Green interferometer with a heating stage and the application of a phase reduction algorithm. The thermal expansion coefficients of MgF2 films at various columnar angles were larger than those of glass substrates. The intrinsic stress in the MgF2 films with columnar microstructures was compressive, while the thermal stress was tensile. The thermal expansion coefficients of MgF2 films with columnar microstructures and their intrinsic stress evidently depended on the deposition angle and the columnar angle.

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Source
http://dx.doi.org/10.1364/AO.50.00C159DOI Listing

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