We present a baseline analysis of issues affecting the economic viability of Soft X-Ray Projection Lithography (SXPL). This analysis is intended to serve as a starting point, and to provide an initial assessment of the relative importance of cost factors in a SXPL system. We presume a "conventional" SXPL system design and focus on wafer exposure costs. A baseline model for system component costs and performance specifications is presented, and the dependence of wafer exposure cost on elements of the model is analyzed. Within the guidelines of our model, we find that direct cost items (e.g., cost of the laser driver) are not nearly as critical as technical performance parameters (e.g., mirror reflectivity) in determining wafer exposure costs.
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http://dx.doi.org/10.3233/XST-1992-3304 | DOI Listing |
J Colloid Interface Sci
March 2025
Multimodal Sensing and Integrated Circuit Laboratory, School of Advanced Materials and Nanotechnology, Xidian University, Xi'an 710126, China. Electronic address:
The development of two-dimensional (2D) layered MXene materials has opened new possibilities for gas adsorption applications due to their high specific surface area, tunable surface chemistry, and excellent selectivity towards specific gases. These materials exhibit tremendous potential in adsorption-based gas separation and detection, particularly due to their strong interactions with target gas molecules, making them highly effective in gas removal and detection applications. However, currently available methods for synthesizing these oxidized nanocomposite inks are limited by the typically high temperatures involved.
View Article and Find Full Text PDFMicromachines (Basel)
October 2024
Samara National Research University, 443086 Samara, Russia.
The relative motion of the reticle stage and wafer stage caused by vibration during the scanning exposure process of the lithography machine is an important factor that affects the imaging quality under limited lithography ability. In this paper, the influence of the vibration of the lithography stage system on the lithography imaging quality is studied. The lithography model including the vibration error of the stage is taken into account in the framework of source and mask optimization (SMO).
View Article and Find Full Text PDFNanotechnology
November 2024
R&D center, S&S Tech Corporation, 42- Hosandog ro, Dalseo, gu, Deagu 42714, Republic of Korea.
In the extreme ultraviolet lithography (EUVL) process, extreme ultraviolet (EUV) pellicles serve as thin, transparent membranes that shield the photomask (reticle) from particle contamination, thereby preserving photomask pattern integrity, reducing chip failure risks, and enhancing production yields. The production of EUV pellicles is highly challenging due to their mechanical fragility at nanometer-scale thicknesses and the need to endure the rigorous conditions of the EUVL environment, which include high temperatures and hydrogen radicals. Consequently, extensive research has been conducted on a variety of materials, such as carbon-based and silicon-based substances, for the development of EUV pellicles.
View Article and Find Full Text PDFNat Commun
October 2024
Guangdong Provincial Key Laboratory of Nanophotonic Functional Materials and Devices, School of Information and Optoelectronic Science and Engineering, South China Normal University, Guangzhou, China.
Lithography technology is a powerful tool for preparing complex microstructures through projecting patterns from static templates with permanent features onto samples. To simplify fabrication and alignment processes, dynamic photomask for multiple configurations preparation becomes increasingly noteworthy. Hereby, we report a dynamic photomask by assembling the electrically stimulated nematic liquid crystal (NLC) into multifarious architectures.
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