Visualization and minimization of disruptive bubble behavior in ultrasonic field.

Although ultrasonic technology has been successfully adopted for semiconductor cleaning, a recent trend of extreme miniaturization of patterns calls for a novel process that can remove contaminant particles without damaging nanoscale patterns. Unstable bubble oscillations have been hypothesized to cause such surface damages, and here we show direct visualization results that a high acoustic pressure induces bubble instability leading to pattern damages. As a remedy for the conventional ultrasonic cleaning scheme, we introduce a novel cleaning system using dual transducers, in which one transducer generates bubbles with a high acoustic pressure in an acoustically isolated sub-chamber and the other drives the oscillation of bubbles around the cleaning area at a low acoustic pressure. The system is shown to achieve a high cleaning efficiency for submicron-sized particles while significantly suppressing the disruptive bubble instability thereby reducing the detachment of firmly attached nanoparticles. Comparison of the adhesion force of the firmly attached nanoparticles and the yield strength of nanopatterns allows us to anticipate that this scheme is capable of reducing damages of nanopatterns on semiconductor wafers and photomasks.