[Effects of decimeter wave and sodium hyaluronate product on postoperative adhesions in flexor tendon].

Objective: To compare the effect of decimeter wave with sodium hyaluronate product (SHP) on preventing and treating peritendinous adhesion and promoting tendon healing.

Methods: Totally 96 healthy male white 6-month-old Leghorn chickens weighing (2.24 +/- 0.07) kg were randomized into group A (decimeter wave therapy group, n = 32), in which decimeter wave therapy was applied 1 to 21 days after operation at a frequency of 915 MHz, a power of 8 W, radiation distance of 10 cm, for 10 minutes once per day; group B (SHP group, n = 32), in which 5 mL and 1.2% SHP was applied; and group C (control group, n = 32), in which injury received no treatment. The III and IV toes of left feet of all chickens were made into tendon injury model. The general condition of animal was observed after operation; gross and histological observations were made 7, 10, 14, 18, 21 and 28 days after operation, and the biomechanical analysis was done 14 and 28 days after operation.

Results: Operative incision healed well, no infection and death occurred. Peritendinous adhesions in groups A, B were looser, and tendon healing was better than that of group C 14 and 28 days after operation. More fibroblasts with active metabolism and more collagen formation in groups A, B than that in group C. The Pmax of group A was better than that of group B 14 and 28 days after operation (P < 0.05); the delta max of group A was better than that of group B 18 and 21 days after operation (P < 0.05), and the W0 of group A was better than that of group B 18, 21 and 28 days after operation (P < 0.05). There was no significant difference between group A and group B at the other time points.

Conclusion: Topical decimeter wave therapy and application of SHP after flexor tendon repair can promote intrinsic healing, meanwhile they can prevent the adhesion of tendon and reduce extrinsic healing. Decimeter wave therapy can improve the qualities of tendon's wound healing.