In this article we determined the thermal diffusion coefficient (D(T)) in equimolar mixtures of n-alkanes nC(i)-nC(12) (i=5,6,7,8,9,17,18), nC(i)-nC(10) (i=5,6,7,15,16,17,18), and nC(i)-nC(6) (i=10,12,14,16,18) at 25 degrees C and at atmospheric pressure using the thermogravitational technique. The results obtained from this study together with the previously published ones in the series of nC(i)-nC(18) (i=5,6,7,8,9,10,11,12,13) show that the main parameter that determines D(T) in each series is in association with the molecular weights of the mixture's components. However, an empirical quantitative correlation has been obtained between D(T), the molecular weights of the components, the viscosity, and the thermal expansion coefficient of the mixtures. This is the first report of a closely accurate correlation for D(T) in liquid mixtures.
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http://dx.doi.org/10.1063/1.2945901 | DOI Listing |
Sci Rep
January 2025
Department of Mechanical Engineering, College of Engineering and Computer Sciences, Jazan University, P.O Box 45124, Jazan, Saudi Arabia.
Fluid flow across a Riga Plate is a specialized phenomenon studied in boundary layer flow and magnetohydrodynamic (MHD) applications. The Riga Plate is a magnetized surface used to manipulate boundary layer characteristics and control fluid flow properties. Understanding the behavior of fluid flow over a Riga Plate is critical in many applications, including aerodynamics, industrial, and heat transfer operations.
View Article and Find Full Text PDFCommun Eng
January 2025
Guangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal University, Guangzhou, 510006, PR China.
Conventional electronic chip packaging generates a huge thermal resistance due to the low thermal conductivity of the packaging materials that separate chip dies and coolant. Here we propose and fabricate a closed high-conducting heat chip package based on passive phase change, using silicon carbide which is physically and structurally compatible with chip die materials. Our "chip on vapor chamber" (CoVC) concept realizes rapid diffusion of hot spots, and eliminates the high energy consumption of refrigeration ordinarily required for heat management.
View Article and Find Full Text PDFNat Commun
January 2025
Institute for Materials Science, University of Stuttgart, D-70569, Stuttgart, Germany.
The knowledge of diffusion mechanisms in materials is crucial for predicting their high-temperature performance and stability, yet accurately capturing the underlying physics like thermal effects remains challenging. In particular, the origin of the experimentally observed non-Arrhenius diffusion behavior has remained elusive, largely due to the lack of effective computational tools. Here we propose an efficient ab initio framework to compute the Gibbs energy of the transition state in vacancy-mediated diffusion including the relevant thermal excitations at the density-functional-theory level.
View Article and Find Full Text PDFJ Am Chem Soc
January 2025
Department of Mechanical Engineering & Materials Science and Engineering Program, State University of New York at Binghamton, Binghamton, New York 13902, United States.
In contrast to the traditional perspective that thermal fluctuations are insignificant in surface dynamics, here we report their influence on surface reaction dynamics. Using real-time low-energy electron microscopy imaging of NiAl(100) under both vacuum and O atmospheres, we demonstrate that transient temperature variations substantially alter the direction of atom diffusion between the surface and bulk, leading to markedly different oxidation outcomes. During heating, substantial outward diffusion of atoms from the bulk to the surface results in step growth.
View Article and Find Full Text PDFPhys Rev Lett
December 2024
Department of Physics, University of Washington, Seattle, Washington 98195, USA.
We study hydrodynamic thermal transport in high-mobility two-dimensional electron systems placed in an in-plane magnetic field and identify a new mechanism of thermal magnetotransport. This mechanism is caused by drag between the electron populations with opposite spin polarization, which arises in the presence of a hydrodynamic flow of heat. In high mobility systems, spin drag results in strong thermal magnetoresistance, which becomes of the order of 100% at relatively small spin polarization of the electron liquid.
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