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Effect of heat application on adhesion of epoxy resin sealer. | LitMetric

Effect of heat application on adhesion of epoxy resin sealer.

J Endod

Department of Endodontology, School of Dentistry, Aristotle University of Thessaloniki, Thessaloniki, Greece.

Published: November 2008

Sealers are subjected to high temperatures during the warm condensation of gutta-percha; however, there are few reports on the impact of this temperature rise on the physical properties of a sealer. The purpose of this study was to compare the bond strength of AH26 to human dentin substrates, with or without heat application, by measuring the shear bond strength with a single plane shear test assembly. The results showed that there was no statistically significant difference between the shear bond strength of AH26 with or without heat application, indicating that the use of this sealer with all warm compaction techniques might be considered safe from this perspective.

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Source
http://dx.doi.org/10.1016/j.joen.2008.07.026DOI Listing

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