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Influence of Deposition Temperature on Cu-BDC Surface-Anchored Metal-Organic Framework Formation.
J Phys Chem C Nanomater Interfaces
January 2025
Furman University, Greenville, South Carolina 29613, United States.
Surface-anchored metal-organic frameworks (surMOFs) are crystalline, nanoporous, supramolecular materials mounted to substrates that have the potential for integration within device architectures relevant for a variety of electronic, photonic, sensing, and gas storage applications. This research investigates the thin film formation of the Cu-BDC (copper benzene-1,4-dicarboxylate) MOF system on a carboxylic acid-terminated self-assembled monolayer by alternating deposition of solution-phase inorganic and organic precursors. X-ray diffraction (XRD) and atomic force microscopy (AFM) characterization demonstrate that crystalline Cu-BDC thin films are formed via Volmer-Weber growth.
View Article and Find Full Text PDFA Low-Symmetry Copper Benzenehexathiol Coordination Polymer with In-Plane Electrical Anisotropy.
Angew Chem Int Ed Engl
January 2025
The University of Hong Kong, Department of Chemistry, Pokfulam Road, 999077, Hong Kong, CHINA.
Electrically conductive coordination polymers (ECCPs), particularly those incorporating benzenehexathiol (BHT) ligands, are emerging as a distinctive class of electronic materials with tunable semiconducting and metallic properties. However, the exploration of novel ECCPs with low-symmetry structures and electrical anisotropy remains under development. Here, we report the on-water surface synthesis of a novel ECCP, namely Cu5BHT, which exhibits a low-symmetry structure and unique in-plane electrical anisotropy that differs from the well-known Cu3BHT phase.
View Article and Find Full Text PDFInfluence of Heat Treatment on the Microstructure and Mechanical Properties of Pure Copper Components Fabricated via Micro-Laser Powder Bed Fusion.
Materials (Basel)
December 2024
Department of Mechanical and Automation Engineering, The Chinese University of Hong Kong, Hong Kong, China.
Pure copper (Cu) is widely used across numerous industries owing to its exceptional thermal and electrical conductivity. Additive manufacturing has facilitated the rapid and cost-effective prototyping of Cu components. Laser powder bed fusion (LPBF) has demonstrated the capability to produce intricate Cu components.
View Article and Find Full Text PDFMicrostructure and properties of joint of Al/Cu welded by resistance element welding with an auxiliary gasket of Ni.
Sci Rep
January 2025
College of Material Science and Engineering, Henan Institute of Technology, Xinxiang, 453003, China.
A rivet of aluminum and auxiliary gasket of nickel were adopted to weld A1060 aluminum plate and T2 copper plate using resistance element welding. The interfacial microstructure was analyzed and the tensile shear load of the joint was tested. A layer of AlCu and the eutectic structure of AlCu and (Al) were formed in the interfacial zone of Al/Cu.
View Article and Find Full Text PDFInner Helmholtz layer control through co-solvent strategies for high-performance copper hexacyanoferrate//zinc battery.
J Colloid Interface Sci
December 2024
Department of Mechanical Engineering, University of Alberta, 9211-116 Street NW., Edmonton, Alberta T6G 1H9, Canada. Electronic address:
Copper hexacyanoferrate (CuHCF) demonstrates high working voltage, convenient synthesis methods, and economic benefits. However, capacity decay of CuHCF//Zn full cells is usually observed in aqueous electrolytes due to the dissolution of Cu and Fe, as indicated by the irreversible insertion of Zn ions and the consequent formation of ZnCuHCF. To address these challenges, a cathode-oriented electrolyte engineering design employing a methyl acetate (MA) co-solvent with zinc triflate (Zn(OTf)) salt electrolyte is implemented.
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