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Enhanced characterization of wheat straw-PLA composites with silane coupling agent and alkali pretreatment.
Ecotoxicol Environ Saf
December 2024
Hebei University of Science and Technology, 050018, China. Electronic address:
Polylactic acid (PLA) composites with high straw content face several challenges, primarily due to the inherent brittleness of straw and its poor compatibility with the polymer matrix. In this study, scanning electron microscopy (SEM) was used to analyze the microscopic structure of wheat straw chemically modified by NaOH and the silane coupling agent, and it was concluded that both treatments effectively removed waxes and silica from the surface of the straw, enhanced fiber roughness, and improved interfacial adhesion. Notably, the silane coupling agent treatment not only facilitated the formation of chemical bonds between the straw fibers and the PLA matrix but also filled the interfiber pores, significantly increasing the structural density.
View Article and Find Full Text PDFPd(0)/Pd(II) Electromerism Triggered by Lewis Base Coordination to a Redox-Active Silicon Z-Type Ligand.
Angew Chem Int Ed Engl
December 2024
Universität Heidelberg: Universitat Heidelberg, Anorganisch-Chemisches Institut, Im Neuenheimer Feld 270, 69120, Heidelberg, GERMANY.
Electromerism (aka. valence tautomerism) corresponds to the switching of electronic distributions between redox-active ligands and central elements. While this phenomenon is well established for several transition metals, the Pd(0)/Pd(II) couple could not yet be involved due to the high energy of the Pd(0) state.
View Article and Find Full Text PDFCross-Dehydrogenative Coupling of Secondary Amines with Silanes Catalyzed by Agostic Iridium-NSi Species.
Inorg Chem
December 2024
Departamento de Química Inorgánica, Instituto de Síntesis Química y Catálisis Homogénea (ISQCH), Facultad de Ciencias, Universidad de Zaragoza - CSIC, 50009 Zaragoza, Spain.
An active catalytic system for the cross-dehydrogenative coupling (CDC) of a wide range of secondary amines with silanes is reported. The iridium(III) derivatives [Ir(H)(X)(κ-NSi)(L)] (NSi = {4,8-dimethylquinoline-2-yloxy}dimethylsilyl; L = coe, X = Cl, ; L = coe, X = OTf, ; L = PCy, X = Cl, ; L = PCy X = OTf, ), which are stabilized by a weak yet noticeable Ir···H-C agostic interaction between the iridium and one of the C-H bonds of the 8-Me substituent of the NSi ligand, have been prepared and fully characterized. These species have proven to be effective catalysts for the CDC of secondary amines with hydrosilanes.
View Article and Find Full Text PDFOrgano-photocatalytic dearomative hydrosilylation of indoles with silanes.
Org Biomol Chem
December 2024
College of New Energy, State Key Laboratory of Heavy Oil Processing, China University of Petroleum (East China) 266580, Qingdao, P. R. China.
A photocatalytic dearomative hydrosilylation reaction of indole derivatives with silanes has been accomplished for the synthesis of valuable indolinyl silanes through a carbon-silyl radical coupling process with the cooperation of photoredox and hydrogen atom transfer catalytic systems composed of 3DPA2FBN (2,4,6-tris(diphenylamino)-3,5-difluorobenzonitrile), (i-Pr)SiSH, and base additives. This protocol is featured by a broad substrate scope, transition metal-free conditions, high diastereoselectivities and applications in natural product derivatives.
View Article and Find Full Text PDFFundamental Insights into Copper-Epoxy Interfaces for High-Frequency Chip-to-Chip Interconnects.
ACS Appl Mater Interfaces
December 2024
Gordon A. and Mary Cain Department of Chemical Engineering, Louisiana State University, Baton Rouge, Louisiana 70803, United States.
Future processes and materials are needed to enable multichip packages with chip-to-chip (C2C) data rates of 50 GB/s or higher. This presents a fundamental challenge because of the skin effect, which exacerbates signal transmission losses at high frequencies. Our results indicate that smooth copper interconnects with relatively thin cuprous oxides (CuO, Cu) and amine-functional silane adhesion promoters improve interfacial adhesion with epoxy dielectrics by nearly an order of magnitude.
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