Download full-text PDF |
Source |
|---|
Publication Analysis
Top Keywords
Similar Publications
Mechanistic Study of Atomic Oxygen Erosion on Polyimide Under Electric Fields: A Molecular Dynamics and Density Functional Theory Approach.
Molecules
November 2024
School of Electrical Engineering, Shandong University, Jinan 250061, China.
Polyimide (PI) is widely used in aerospace applications due to its superior insulating properties. However, the high concentration of atomic oxygen (AO) in low Earth orbit leads to significant performance degradation in PI, and the underlying mechanism of AO erosion under an electric field remains unclear. This study utilizes molecular dynamics simulations to model AO erosion on PI under various electric field strengths and explores the corresponding degradation mechanisms.
View Article and Find Full Text PDFTemperature and Physicochemical Properties of Abnormal Heating Composite Insulators.
Polymers (Basel)
October 2024
Xuefeng Mountain Energy Equipment Safety National Observation and Research Station, Chongqing University, Chongqing 400044, China.
Abnormal heating will reduce the insulation performance of composite insulators or even cause insulator fracture, and the abnormal heating phenomenon is more serious under high-humidity conditions. Therefore, in this paper, the voltage withstand test of abnormal heating composite insulators caused by aging and damp sheath, decay-like core rod, and contamination were carried out under different ambient humidity. The heating and discharge of composite insulators were observed by infrared thermal imager and ultraviolet imager, and its temperature characteristics were analyzed from the aspects of heating range, heating shape, and temperature difference.
View Article and Find Full Text PDFThe Catalytic Effect of Low Molecular Weight Acids on the Physicochemical and Dielectric Properties of Oil-Paper Insulation Systems.
Polymers (Basel)
September 2024
Department of Applied Sciences (DSA), University of Quebec at Chicoutimi (UQAC), Saguenay, QC G7H 2B1, Canada.
In most industrialized countries, power transformers built several decades ago are approaching the end of their operational lifespan. The ongoing energy transition, focused on developing 100% renewable energy sources and accelerating global transportation electrification, further exacerbates these assets. Combined with rising electricity demand, there is an increasing risk of critical transformers' degradation acceleration.
View Article and Find Full Text PDFUnraveling the role of oligodendrocytes and myelin in pain.
J Neurochem
January 2025
Université Paris Cité, Institute of Psychiatry and Neuroscience of Paris (IPNP), INSERM U1266, "Team: Interactions between Neurons and Oligodendroglia in Myelination and Myelin Repair", Paris, France.
Oligodendrocytes, the myelin-producing cells in the central nervous system (CNS), are crucial for rapid action potential conduction and neuronal communication. While extensively studied for their roles in neuronal support and axonal insulation, their involvement in pain modulation is an emerging research area. This review explores the interplay between oligodendrocytes, myelination, and pain, focusing on neuropathic pain following peripheral nerve injury, spinal cord injury (SCI), chemotherapy, and HIV infection.
View Article and Find Full Text PDFDiamond-Reinforced Al(HPO)@Epoxy Hybrid Thermal Adhesive With Ultra-High Thermal Conductivity and Bonding Strength.
Small
November 2024
National Key Laboratory of Science and Technology on Advanced Composites in Special Environments, Harbin Institute of Technology, Harbin, 150080, P. R. China.
Article Synopsis
- The study highlights heat dissipation issues in modern electronic devices and proposes a new composite adhesive that enhances heat transfer while securely bonding components.
- The innovative composite combines inorganic phosphate/alumina with diamond filler, achieving an impressive thermal conductivity of 18.96 W m K, while still being electrically insulating.
- A hybrid adhesive structure developed using organic modifications not only retained high thermal conductivity of 3.23 W m K but also provided strong adhesion, showcasing its potential for improving chip soldering, packaging, and cooling.
Want AI Summaries of new PubMed Abstracts delivered to your In-box?
Enter search terms and have AI summaries delivered each week - change queries or unsubscribe any time!