Diamond powder can be successfully cemented with cobalt. At 62 kilobars the sintering occurs over the temperature range from 1570 degrees to 1610 degrees C. The maximum microhardness of the compact ( 3000 kilograms per square millimeter on the Knoop scale) is obtained with a mixture of 20 percent cobalt (by volume) and a diamond particle size of 1 to 5 micrometers.
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http://dx.doi.org/10.1126/science.172.3988.1132 | DOI Listing |
ACS Appl Mater Interfaces
January 2025
State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083, China.
The additive manufacturing of hardmetals has attracted great attention recently but faces significant challenges in low printing resolution and low mechanical strength. Herein, the fabrication of hardmetal parts with complex structures and high surface quality by vat photopolymerization assisted with a sintering process has been achieved. This was enabled by in situ polymerization-induced microencapsulation of WC powder, which simultaneously enhances the photocuring ability and sedimentation stability of the WC-Co slurry.
View Article and Find Full Text PDFNanomaterials (Basel)
January 2025
Guangdong Provincial Key Laboratory of Electronic Functional Materials and Devices, Huizhou University, Huizhou 516001, China.
Cu/Diamond (Cu/Dia) composites are regarded as next-generation thermal dissipation materials and hold tremendous potential for use in future high-power electronic devices. The interface structure between the Cu matrix and the diamond has a significant impact on the thermophysical properties of the composite materials. In this study, Cu/Dia composite materials were fabricated using the Spark Plasma Sintering (SPS) process.
View Article and Find Full Text PDFMicromachines (Basel)
November 2024
School of Materials Science and Chemical Engineering, Harbin University of Science and Technology, Harbin 150080, China.
Integrating nanocrystalline diamond (NCD) films on silicon chips has great practical significance and many potential applications, including high-power electronic devices, microelectromechanical systems, optoelectronic devices, and biosensors. In this study, we provide a solution for ensuring heterogeneous interface integration between silicon (Si) chips and NCD films using low-temperature bonding technology. This paper details the design and implementation of a magnetron sputtering layer on an NCD surface, as well as the materials and process for the connection layer of the integrated interface.
View Article and Find Full Text PDFMaterials (Basel)
December 2024
Hunan Province Engineering Research Center for High Thermal Conductivity Metal-Matrix Composites, Hunan Harvest Technology Development Co., Changsha 410219, China.
Spark plasma sintering (SPS) is an effective technique for studying the diffusion bonding of diamond/Cu composites, and has the potential to advance the application of copper matrix composites. This study investigates the SPS diffusion bonding of diamond/Cu composites using a chromium (Cr) interlayer. The effects of process parameters on the microstructure and mechanical properties of the bonding interface were evaluated through shear strength testing and SEM analysis.
View Article and Find Full Text PDFBraz Dent J
December 2024
Post-graduate Program in Oral Science, Prosthodontic Unit, Faculty of Odontology, Federal University of Santa Maria(UFSM), Santa Maria, Rio Grande do Sul, Brazil.
This study evaluated the effect of grinding and finishing treatments (polishing or glaze) on the color stability, translucency and opalescence of a translucent zirconia (3Y-TZP) after immersion in red wine. Discs (Ø= 12 mm; thickness 0.8 mm) of 3Y-TZP (Zenostar T, Ivoclar AG) were randomly allocated (n= 8) according to the surface treatment factor: Ctrl - as-sintered; Gr - grinding with diamond bur #4219; Gr + Pol - grinding followed by polishing; Gr + Gl - grinding followed by glaze.
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