The viability of near-infrared femtosecond laser ablation (fs-LA) inductively coupled plasma mass spectrometry (ICPMS) for the in-depth analysis of polymer coatings over galvanized steel substrates has been studied. A good depth resolution was obtained modifying the femtosecond Gaussian beam to a flat-top beam by using a liquid-crystal display. In order to avoid mixing of information coming from successive shots, a low repetition rate was accomplished and signals were monitored shot by shot. Different kinds of coatings were used to demonstrate the capability of femtosecond ablation for depth-profiling analysis. Ablation was conducted under He atmosphere, after sample cell Ar was admixed. The depth profiles obtained by LA-ICPMS are in good agreement with those obtained by GD-OES for the three analyzed samples. In cases where due to averaging over several millimeter sample roughness determines the depth resolution of GD-OES, it was found that LA-ICPMS achieves better depth resolution due to the better lateral resolution. The depth resolution obtained by LA-ICPMS was found to be 240 nm and 2.3 microm, for a hot-dip galvanized steel (HDGS) and a polymer-polymer-coated HDGS, respectively, compared to the 2.2 and 4.5 microm achieved with GD-OES for the same samples.
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http://dx.doi.org/10.1021/ac070241q | DOI Listing |
Sensors (Basel)
January 2025
Huawei Technologies Co., Ltd., Chengdu 610000, China.
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January 2025
Faculty of Science and Technology, Keio University, Yokohama 223-8522, Japan.
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January 2025
Meteorology and Fluid Science Division, Central Research Institute of Electric Power Industry, 1646 Abiko, Abiko-shi 270-1194, Chiba, Japan.
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December 2024
School of Physics and Astronomy, University of Glasgow, Glasgow G12 8QQ, UK.
Accurate depth estimation is crucial for many fields, including robotics, navigation, and medical imaging. However, conventional depth sensors often produce low-resolution (LR) depth maps, making detailed scene perception challenging. To address this, enhancing LR depth maps to high-resolution (HR) ones has become essential, guided by HR-structured inputs like RGB or grayscale images.
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January 2025
Department of Machine Design and Manufacturing Engineering, Kielce University of Technology, al. Tysiaclecia Panstwa Polskiego 7, 25-314 Kielce, Poland.
The minimum cutting thickness is a key value in machining processes, as below this value the material will only undergo elastic and plastic deformation without chip removal. Existing measurement methods require time-consuming preparation and complicated procedures. This work focuses on the development of a new, simplified method for determining the minimum cutting thickness (h) using a contact profilometer that can be used in industry.
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