Severity: Warning
Message: file_get_contents(https://...@gmail.com&api_key=61f08fa0b96a73de8c900d749fcb997acc09&a=1): Failed to open stream: HTTP request failed! HTTP/1.1 429 Too Many Requests
Filename: helpers/my_audit_helper.php
Line Number: 176
Backtrace:
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 176
Function: file_get_contents
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 250
Function: simplexml_load_file_from_url
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 1034
Function: getPubMedXML
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 3152
Function: GetPubMedArticleOutput_2016
File: /var/www/html/application/controllers/Detail.php
Line: 575
Function: pubMedSearch_Global
File: /var/www/html/application/controllers/Detail.php
Line: 489
Function: pubMedGetRelatedKeyword
File: /var/www/html/index.php
Line: 316
Function: require_once
Objectives: To define the inlay shading effect on the polymerization levels and kinetics of a light activated bonding system for an indirect restoration technique.
Materials And Methods: For the bonding system, an adhesive: Excite (Ivoclar-vivadent) and a composite: Z250 (3M-ESPE, St Paul Minnesota, USA) were investigated. A Demetron (Kerr USA) light curing unit was used. The composite inlay blocks of 2 mm thick were used for the experiment (Artglass A2 Heraeus, Kulzer, Dormagen, Germany). The bonding composite was photocured using a 2 mm composite inlay block as a shielding system while the adhesive was shielded by a 2.3 mm thick wafer, composed of the inlay material and the previously cured bonding composite. The kinetics and levels of polymerization were measured by a differential scanning calorimeter technique (DSC 25, Mettler, Orange, CA, Toledoh, küsnacht, switzerland).
Results: The inlay shielded dental composite reaches a significantly lower level of polymerization compared to the unshielded composite. Inlay shielded composite, has a slower polymerization kinetic compared to unshielded composite. The resin adhesive shielded by the inlay-composite wafer reaches polymerization values not significantly different from those of the unshielded adhesive.
Significances: The degree of cure of the light-cured composite resins for use as a base for indirect composite restorations, may be severely reduced as a result of inlay shielding.
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Source |
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http://dx.doi.org/10.1016/j.dental.2004.09.008 | DOI Listing |
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